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Titlebook: Optical Communication over Plastic Optical Fibers; Integrated Optical R Mohamed Atef,Horst Zimmermann Book 2013 Springer-Verlag Berlin Heid

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樓主: 異國
31#
發(fā)表于 2025-3-26 21:49:38 | 只看該作者
32#
發(fā)表于 2025-3-27 03:06:19 | 只看該作者
Book 2013mission loss, very sensitive receivers must be used to increase the transmitted length over POF. The plastic optical fiber limited bandwidth problem can be decreased by using multilevel signaling like multilevel pulse amplitude modulation or by using an equalizer for binary data transmission. .
33#
發(fā)表于 2025-3-27 05:28:40 | 只看該作者
0342-4111 r POF. The plastic optical fiber limited bandwidth problem can be decreased by using multilevel signaling like multilevel pulse amplitude modulation or by using an equalizer for binary data transmission. .978-3-642-42829-6978-3-642-30388-3Series ISSN 0342-4111 Series E-ISSN 1556-1534
34#
發(fā)表于 2025-3-27 12:57:33 | 只看該作者
35#
發(fā)表于 2025-3-27 15:24:29 | 只看該作者
Multilevel Signaling,se ratio (SNR) caused by multilevel signaling is not significant over short distances of optical fiber. The use of multilevel signaling for light Intensity Modulation Direct-Detection (IM-DD) systems has received an attention in the literature [12–15].
36#
發(fā)表于 2025-3-27 18:49:15 | 只看該作者
37#
發(fā)表于 2025-3-28 00:10:23 | 只看該作者
Introduction, introduction of new services and the creation of links between services (such as between video and data services). A single broadband multi-services network could provide an efficient solution to host and connect all existing and upcoming services together.
38#
發(fā)表于 2025-3-28 04:36:21 | 只看該作者
Equalization Techniques,s for such equalizers. The equalization target is to reduce distortion and BER to acceptable levels. The equalizer can be made of discrete components on PCB, integrated using silicon technologies like CMOS or BiCMOS or built into cables or connectors.
39#
發(fā)表于 2025-3-28 06:43:11 | 只看該作者
40#
發(fā)表于 2025-3-28 13:22:44 | 只看該作者
Integrated Optical Receiver and Multilevel Transmission over PMMA SI-POF,an be optimized separately by using special photodiode and IC technologies. The drawback is high costs due to a complex production and assembly process. Other disadvantages of using discrete photodiodes are potential noise sources and bandwidth reduction due to bonding pads and package pins.
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