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Titlebook: On-Chip ESD Protection for Integrated Circuits; An IC Design Perspec Albert Z. H. Wang Book 2002 Springer Science+Business Media New York 2

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發(fā)表于 2025-3-25 04:52:54 | 只看該作者
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0893-3405 ection for Integrated Circuits: An IC Design Perspective. provides both fundamental and advanced materials needed by a circuit designer for designing ESD protection circuits, including: ..Testing models and standards adopted by U.S. Department of Defense, EIA/JEDEC, ESD Association, Automotive Elect
25#
發(fā)表于 2025-3-25 23:51:57 | 只看該作者
Advanced ESD Protection,ons in ESD protection circuit design. The ESD-circuit interaction becomes an inevitable and critical issue in chip-level ESD protection design. The ESD-to-circuit influence must be considered in chip designs. Circuit malfunction due to possible accidental triggering of ESD protection structures caus
26#
發(fā)表于 2025-3-26 02:21:29 | 只看該作者
ESD Failure Analysis and Modeling, understand ESD protection failure mechanisms and to avoid making similar design mistakes repeatedly. Typical ESD failure signatures, such as, silicon filament, metal interconnect burnout, contact spiking, gate oxide rupture, etc, are discussed. Case examples are given to show how FA analysis techni
27#
發(fā)表于 2025-3-26 06:03:08 | 只看該作者
28#
發(fā)表于 2025-3-26 08:53:53 | 只看該作者
ESD-circuit Interactions,re itself. A working stand-alone ESD protection structure does not guarantee a functional IC chip. There exist strong ESD-circuit interactions. On one hand, the core circuit may affect the performance of ESD protection significantly, resulting in pre-mature ESD failures due to parasitic internal dis
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