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Titlebook: On and Off-Chip Crosstalk Avoidance in VLSI Design; Chunjie Duan,Brock J. LaMeres,Sunil P. Khatri Book 2010 Springer-Verlag US 2010 Crosst

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31#
發(fā)表于 2025-3-26 21:34:46 | 只看該作者
Summary of Off-Chip Crosstalk Avoidancece. This mismatch in performance between the IC and the package is now the leading limitation to system performance. Inter-chip busses that transfer data between ICs within the system need to be slowed so as to avoid unwanted noise from the package. Off-chip communication is now the largest bottleneck in modern digital systems design.
32#
發(fā)表于 2025-3-27 03:14:51 | 只看該作者
33#
發(fā)表于 2025-3-27 07:18:34 | 只看該作者
34#
發(fā)表于 2025-3-27 10:28:40 | 只看該作者
Bus Expansion Encoderckage. By inserting this encoder in the signal path on the IC, it ensures that the off-chip data is encoded before traversing the package interconnect. In this way, data sequences which result in noise above a specified limit can be avoided and the bus performance can be increased.
35#
發(fā)表于 2025-3-27 17:34:04 | 只看該作者
36#
發(fā)表于 2025-3-27 18:42:31 | 只看該作者
Memory-based Crosstalk Avoidance Codeslled ?memorybased code“. The decoder also uses the current received codeword and either the previous received codeword or the previous decoded data word to decode the current data word. The memory depth of CACs we consider is one.
37#
發(fā)表于 2025-3-27 22:03:33 | 只看該作者
Package Construction and Electrical Modelingn for the IC as well as thermal dissipation. The typically consists of two levels of interconnect. The first is the connection from the IC to the package (level 1) and the second is from the package to the system PCB (level 2).
38#
發(fā)表于 2025-3-28 04:55:51 | 只看該作者
39#
發(fā)表于 2025-3-28 09:40:05 | 只看該作者
40#
發(fā)表于 2025-3-28 11:39:44 | 只看該作者
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