| 書目名稱 | Nanopackaging | | 副標(biāo)題 | Nanotechnologies and | | 編輯 | James E. Morris | | 視頻video | http://file.papertrans.cn/661/660858/660858.mp4 | | 概述 | Offers a comprehensive discussion of Nanoparticles and Carbon Nanotubes, and how and why they are rapidly becoming materials options for electronics packaging.Discusses the importance of computer mode | | 圖書封面 |  | | 描述 | .Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.. | | 出版日期 | Book 20081st edition | | 關(guān)鍵詞 | Nanotube; carbon nanotubes; nano-silica filler; nanocomposite resistors; nanoelectronic; nanomaterials; na | | 版次 | 1 | | doi | https://doi.org/10.1007/978-0-387-47325-3 | | isbn_ebook | 978-0-387-47326-0 | | copyright | Springer-Verlag US 2008 |
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