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Titlebook: Nanoclay Reinforced Polymer Composites; Nanocomposites and B Mohammad Jawaid ,Abou el Kacem Qaiss,Rachid Bouhfi Book 2016 Springer Science+

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31#
發(fā)表于 2025-3-26 21:30:57 | 只看該作者
Mohd Amil Usmani,Imran Khan,Naheed Ahmad,A. H. Bhat,Dhananjay K. Sharma,Jahangir Ahmad Rather,Syed Imanufacturing and faults during system life time. These components include the Networks-on-Chip (NoCs) which are expected to be an important part of the future complex multi-core and many-core chips. As a result, fault tolerant techniques are essential to improve the yield of modern complex chips. I
32#
發(fā)表于 2025-3-27 04:49:50 | 只看該作者
I. El Amrani El Hassani,C. Sadikmanufacturing and faults during system life time. These components include the Networks-on-Chip (NoCs) which are expected to be an important part of the future complex multi-core and many-core chips. As a result, fault tolerant techniques are essential to improve the yield of modern complex chips. I
33#
發(fā)表于 2025-3-27 06:53:28 | 只看該作者
34#
發(fā)表于 2025-3-27 12:03:21 | 只看該作者
Sarat K. Swain,Niladri Sarkar,Gyanaranjan Sahoo,Deepak Sahuign of electrical interconnects increasingly difficult in large chips. Optics provides low power dissipation which remains independent of capacity and distance, as well as wavelength parallelism, ultra-high throughput, and minimal access latencies. Additionally, wavelength routing, bit rate transpar
35#
發(fā)表于 2025-3-27 14:00:06 | 只看該作者
Meriem Fardioui,Mohamed El Mehdi Mekhzoum,Abou el Kacem Qaiss,Rachid Bouhfide, performance, and yield, and complicating the synthesis of critical interc- nects. The problem is especially acute as interconnects are becoming the performance bottleneck in modern integrated circuits. Even with more than 30% of white space, some of the design blocks in modern microprocessor and
36#
發(fā)表于 2025-3-27 20:10:57 | 只看該作者
37#
發(fā)表于 2025-3-28 00:16:01 | 只看該作者
Mohammad Khalid,Rashmi Walvekar,Mohammad Reza Ketabchi,Humaira Siddiqui,M. Enamul Hoque future.Equips readers with the knowledge to prudently choosWith dramatic increases in on-chip packing densities, routing congestion has become a major problem in integrated circuit design, impacting convergence, performance, and yield, and complicating the synthesis of critical interc- nects. The p
38#
發(fā)表于 2025-3-28 04:44:09 | 只看該作者
39#
發(fā)表于 2025-3-28 09:58:13 | 只看該作者
40#
發(fā)表于 2025-3-28 13:24:20 | 只看該作者
N. A. Mohd Nor,S. N. A. Muttalib,N. Othman future.Equips readers with the knowledge to prudently choosWith dramatic increases in on-chip packing densities, routing congestion has become a major problem in integrated circuit design, impacting convergence, performance, and yield, and complicating the synthesis of critical interc- nects. The p
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