Titlebook: Nano-Bio- Electronic, Photonic and MEMS Packaging; C. P.(Ching-Ping) Wong,Kyoung-sik (Jack) Moon,Yi L Book 2021Latest edition Springer Nat

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declamation

Some Nanomaterials for Microelectronics and Photonics Packagingsives, molecular wires for electrical interconnects, low-stress and high-thermal conductive flip-chip underfills, high-. dielectric for embedded passives, bio-mimic Lotus effect with both nano- and microsurfaces for self-cleaning and molecular dynamic (MD) simulations for nanomaterial study and prediction, etc.

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Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation and Their Electronic ApplicationsSpray Combustion process as a benchmark and review its capabilities to that of other nanomaterials’ fabrication processes. Examples will mostly be of nanopowders synthesized using nCCVC. Applications of the nanomaterials in the electronic and energy sectors will be discussed.

vocation

Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectroace showed the typical Cu6Sn5 intermetallic compound (IMC) formation. These low melting point SnAg or SnAgCu alloy nanoparticles could be used for low reflow temperature lead-free interconnect applications.

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BRIEF

Some Nanomaterials for Microelectronics and Photonics Packagingplications, including carbon nanotubes (CNTs) for electrical/thermal devices, lead-free nanoalloys for lead-free interconnection, nano-conductive adhesives, molecular wires for electrical interconnects, low-stress and high-thermal conductive flip-chip underfills, high-. dielectric for embedded passi

簡(jiǎn)略

Nano-conductive Adhesives for Nano-electronics Interconnectionernatives to tin/lead (Sn/Pb) solders in electronics packaging applications. In particular, with the requirements for fine-pitch and high-performance interconnects in advanced packaging, nano-conductive adhesives are becoming more and more important due to the special electrical, mechanical, optical

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