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Titlebook: More-than-Moore Devices and Integration for Semiconductors; Francesca Iacopi,Francis Balestra Book 2023 The Editor(s) (if applicable) and

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書目名稱More-than-Moore Devices and Integration for Semiconductors
編輯Francesca Iacopi,Francis Balestra
視頻videohttp://file.papertrans.cn/640/639340/639340.mp4
概述Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems.Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power s
圖書封面Titlebook: More-than-Moore Devices and Integration for Semiconductors;  Francesca Iacopi,Francis Balestra Book 2023 The Editor(s) (if applicable) and
描述.This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems...?..Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems;.Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources;.Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing..
出版日期Book 2023
關(guān)鍵詞Next Generation Computer Design; Flexible and wearable electronics; Neuromorphic computing for IoT; Bra
版次1
doihttps://doi.org/10.1007/978-3-031-21610-7
isbn_softcover978-3-031-21612-1
isbn_ebook978-3-031-21610-7
copyrightThe Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerl
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ms, including flexible electronics, metasurfaces and power s.This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces a
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Francesca Iacopi,Francis BalestraProvides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems.Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power s
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978-3-031-21612-1The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Switzerl
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