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Titlebook: More than Moore Technologies for Next Generation Computer Design; Rasit O. Topaloglu Book 2015 Springer Science+Business Media New York 20

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發(fā)表于 2025-3-21 20:02:56 | 只看該作者 |倒序瀏覽 |閱讀模式
書目名稱More than Moore Technologies for Next Generation Computer Design
編輯Rasit O. Topaloglu
視頻videohttp://file.papertrans.cn/640/639331/639331.mp4
概述Introduces novel memories, using new materials and processing techniques, offering many advantages over dynamic memories such as traditional SRAM and e-DRAM.Describes 3D integration of integrated circ
圖書封面Titlebook: More than Moore Technologies for Next Generation Computer Design;  Rasit O. Topaloglu Book 2015 Springer Science+Business Media New York 20
描述.This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore‘s Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect. .
出版日期Book 2015
關鍵詞3D Integrated Circuits; Emerging Memory for Integrated Circuits; Low Power Integrated Circuits; More th
版次1
doihttps://doi.org/10.1007/978-1-4939-2163-8
isbn_softcover978-1-4939-4710-2
isbn_ebook978-1-4939-2163-8
copyrightSpringer Science+Business Media New York 2015
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SRAM and e-DRAM.Describes 3D integration of integrated circ.This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail wha
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Book 2015 gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as “More than Moore” (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to “Moore‘s Law”. Coverage focuses on three key
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le according to “Moore‘s Law”. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect. .978-1-4939-4710-2978-1-4939-2163-8
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978-1-4939-4710-2Springer Science+Business Media New York 2015
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