| 書(shū)目名稱 | Molecular Adhesion and Its Applications | | 副標(biāo)題 | The Sticky Universe | | 編輯 | Kevin Kendall | | 視頻video | http://file.papertrans.cn/638/637976/637976.mp4 | | 圖書(shū)封面 |  | | 描述 | At the beginning of the twentieth century, engineers and technologists would have recognized the importance of adhesion in two main aspects: First, in the display of friction between surfaces — at the time a topic of growing importance to engineers; the second in crafts requiring the joining of materials — principally wood—to form engineering structures. While physical scientists would have admitted the adhesive properties of glues, gels, and certain pastes, they regarded them as materials of uncertain formulation, too impure to be amenable to precise experiment. Biological scientists were aware also of adhesive phenomena, but the science was supported by documentation rather than understanding. By the end of the century, adhesion and adhesives were playing a crucial and deliberate role in the formulation of materials, in the design and manufacture of engineering structures without weakening rivets or pins, and in the use of thin sections and intricate shapes. Miniaturization down to the micro- and now to the nano-level of mechanical, electrical, electronic, and optical devices relied heavily on the understanding and the technology of adhesion. For most of the century, physical sci | | 出版日期 | Book 2001 | | 關(guān)鍵詞 | Tenacit; adhesion; colloid; dispersion; structure | | 版次 | 1 | | doi | https://doi.org/10.1007/b100328 | | isbn_softcover | 978-1-4757-7492-4 | | isbn_ebook | 978-0-306-48406-3 | | copyright | Springer Science+Business Media New York 2001 |
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