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Titlebook: Modeling of Electrical Overstress in Integrated Circuits; Carlos H. Díaz,Sung-Mo Kang,Charvaka Duvvury Book 1995 Kluwer Academic Publisher

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書目名稱Modeling of Electrical Overstress in Integrated Circuits
編輯Carlos H. Díaz,Sung-Mo Kang,Charvaka Duvvury
視頻videohttp://file.papertrans.cn/637/636238/636238.mp4
叢書名稱The Springer International Series in Engineering and Computer Science
圖書封面Titlebook: Modeling of Electrical Overstress in Integrated Circuits;  Carlos H. Díaz,Sung-Mo Kang,Charvaka Duvvury Book 1995 Kluwer Academic Publisher
描述Electrical overstress (EOS) and Electrostatic discharge (ESD)pose one of the most dominant threats to integrated circuits (ICs).These reliability concerns are becoming more serious with the downwardscaling of device feature sizes..Modeling of Electrical Overstressin. .Integrated Circuits. presents a comprehensive analysis ofEOS/ESD-related failures in I/O protection devices in integratedcircuits. .The design of I/O protection circuits has been done in a hit-or-missway due to the lack of systematic analysis tools and concrete designguidelines. In general, the development of on-chip protectionstructures is a lengthy expensive iterative process that involvestester design, fabrication, testing and redesign. When the technologyis changed, the same process has to be repeated almost entirely. Thiscan be attributed to the lack of efficient CAD tools capable ofsimulating the device behavior up to the onset of failure which is a3-D electrothermal problem. For these reasons, it is important todevelop and use an adequate measure of the EOS robustness ofintegrated circuits in order to address the on-chip EOS protectionissue. Fundamental understanding of the physical phenomena leading todevice f
出版日期Book 1995
關(guān)鍵詞VLSI; development; integrated circuit; material; modeling; semiconductor; semiconductor devices; simulation
版次1
doihttps://doi.org/10.1007/978-1-4615-2788-6
isbn_softcover978-1-4613-6205-0
isbn_ebook978-1-4615-2788-6Series ISSN 0893-3405
issn_series 0893-3405
copyrightKluwer Academic Publishers 1995
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0893-3405 EOS robustness ofintegrated circuits in order to address the on-chip EOS protectionissue. Fundamental understanding of the physical phenomena leading todevice f978-1-4613-6205-0978-1-4615-2788-6Series ISSN 0893-3405
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Book 1995 the onset of failure which is a3-D electrothermal problem. For these reasons, it is important todevelop and use an adequate measure of the EOS robustness ofintegrated circuits in order to address the on-chip EOS protectionissue. Fundamental understanding of the physical phenomena leading todevice f
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0893-3405 ility concerns are becoming more serious with the downwardscaling of device feature sizes..Modeling of Electrical Overstressin. .Integrated Circuits. presents a comprehensive analysis ofEOS/ESD-related failures in I/O protection devices in integratedcircuits. .The design of I/O protection circuits h
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Book 1995erns are becoming more serious with the downwardscaling of device feature sizes..Modeling of Electrical Overstressin. .Integrated Circuits. presents a comprehensive analysis ofEOS/ESD-related failures in I/O protection devices in integratedcircuits. .The design of I/O protection circuits has been do
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Major Processes Shaping the Evolution of Agriculture, Biotechnology, and Biodiversityhnologies. The trends covered include trade and capital market liberalization, the rise of the environmental movement, consumerism, privatization and devolution of government services, and the emergence of the information age. We find that trade liberalization is likely to lead to increased incentiv
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