Titlebook: Microsystems and Nanotechnology; Zhaoying Zhou,Zhonglin Wang,Liwei Lin Book 2012 Tsinghua University Press, Beijing and Springer-Verlag Be

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書目名稱Microsystems and Nanotechnology影響因子(影響力)




書目名稱Microsystems and Nanotechnology影響因子(影響力)學(xué)科排名




書目名稱Microsystems and Nanotechnology網(wǎng)絡(luò)公開度




書目名稱Microsystems and Nanotechnology網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱Microsystems and Nanotechnology被引頻次




書目名稱Microsystems and Nanotechnology被引頻次學(xué)科排名




書目名稱Microsystems and Nanotechnology年度引用




書目名稱Microsystems and Nanotechnology年度引用學(xué)科排名




書目名稱Microsystems and Nanotechnology讀者反饋




書目名稱Microsystems and Nanotechnology讀者反饋學(xué)科排名

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吼叫

雪白

Integrated Nanotechnology Based on MEMSlectromechanical properties compared to their microscale counterparts, like the big difference in silicon Young’s modulus value. At last, the bright future of the integrated NEMS techniques and devices are outlooked.

愛花花兒憤怒

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MEMS Processing and Fabrication Techniques and Technology—Silicon-Based Micromachining surface micromachining, isolation, metallization and monolithic integration are specially emphasized; while for bulk micromachining, we discuss more details on different sets of processes after a brief introduction of individual processes, such as DRIE and bonding.

辭職

The Application of STM and AFM in Nanoprocess and Fabricationas molecular devices have been demonstrated. Functionalized nanostructures have been fabricated with STM- and AFM-related techniques through various physical or chemical mechanisms. We expect that process and fabrication with STM and AFM will finally go from laboratory to factory as well as to thousands of families in the coming future.

憂傷

Introduction to MEMS Packagingducts remains a very difficult task. This chapter presents the fundamentals of MEMS/NEMS packaging technology, including packaging processes, hermetic and vacuum encapsulations, thermal issues, packaging reliability, and future packaging trends.

Fretful