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Titlebook: Microscale Heat Conduction in Integrated Circuits and Their Constituent Films; Y. Sungtaek Ju,Kenneth E. Goodson Book 1999 Springer Scienc

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發(fā)表于 2025-3-23 13:38:26 | 只看該作者
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發(fā)表于 2025-3-23 18:25:45 | 只看該作者
Introduction, circuits. Transistors with shorter channel lengths can switch faster. The capability to integrate a larger number of devices generally translates into enhanced capacity and functionality. For these reasons, the semiconductor industry is expected to continue its miniaturization efforts in the coming
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發(fā)表于 2025-3-23 22:48:07 | 只看該作者
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發(fā)表于 2025-3-24 06:07:28 | 只看該作者
High Spatial and Temporal Resolution Thermometry,e potential for high temporal and spatial resolution of the thermoreflectance technique thermoreflectance technique by developing an experimental setup that combines diffraction limited optics with a high speed electrical probing facility. Quantitative as opposed to qualitative temperature distribut
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發(fā)表于 2025-3-24 14:16:43 | 只看該作者
Heat Conduction in Crystalline Silicon Films,rences in the magnitude and temperature dependence of the thermal conductivities of the two types of materials. The short mean free paths of heat carriers in amorphous materials permit the use of the heat diffusion equation to describe thermal phenomena at typical operating temperatures of microdevi
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發(fā)表于 2025-3-25 02:40:23 | 只看該作者
Introduction, decades. Indeed, minimum feature sizes of integrated circuit components are projected to reach the sub-0.1 /un regime during the first decade of the 21st century. A recent study (Timp et al., 1997) demonstrated the operation of field-effect transistors with 61 nm gate width.
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