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Titlebook: Micro-Relay Technology for Energy-Efficient Integrated Circuits; Hei Kam,Fred Chen Book 2015 Springer Science+Business Media New York 2015

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發(fā)表于 2025-3-21 20:03:54 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書(shū)目名稱(chēng)Micro-Relay Technology for Energy-Efficient Integrated Circuits
編輯Hei Kam,Fred Chen
視頻videohttp://file.papertrans.cn/633/632776/632776.mp4
概述Covers microsystem fabrication, MEMS device design, circuit design, circuit micro-architecture and CAD.Describes work previously done in the field and also lays the groundwork and criteria for future
叢書(shū)名稱(chēng)Microsystems and Nanosystems
圖書(shū)封面Titlebook: Micro-Relay Technology for Energy-Efficient Integrated Circuits;  Hei Kam,Fred Chen Book 2015 Springer Science+Business Media New York 2015
描述This volume describes the design of relay-based circuit systems from device fabrication to circuit micro-architectures. This book is ideal for both device engineers as well as circuit system designers, and highlights the importance of co-design across design hierarchies when trying to optimize system performance (in this case, energy-efficiency). The book will also appeal to researchers and engineers focused on semiconductor, integrated circuits, and energy efficient electronics.
出版日期Book 2015
關(guān)鍵詞CMOS Energy Crisis; Circuit Micro-architectures; Integrated Circuit Design; Micro-relay Circuit; Micro-r
版次1
doihttps://doi.org/10.1007/978-1-4939-2128-7
isbn_softcover978-1-4939-5417-9
isbn_ebook978-1-4939-2128-7Series ISSN 2198-0063 Series E-ISSN 2198-0071
issn_series 2198-0063
copyrightSpringer Science+Business Media New York 2015
The information of publication is updating

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Hei Kam,Fred ChenCovers microsystem fabrication, MEMS device design, circuit design, circuit micro-architecture and CAD.Describes work previously done in the field and also lays the groundwork and criteria for future
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Micro-relay Reliability,, dielectric charging, contact surface oxidation, and welding-induced failure. We then use these results to establish the micro-relay design guidelines for applications such as digital logic and CMOS power gates.
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