書(shū)目名稱 | Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packag | 副標(biāo)題 | Volume I Materials P | 編輯 | E. Suhir,Y. C. Lee,C. P. Wong | 視頻video | http://file.papertrans.cn/633/632750/632750.mp4 | 概述 | Most up-to-date, in-depth, practical and easy-to-use information on micro- and opto-electronic materials, assemblies, structures and systems.Practical recommendations are offered on how to successfull | 圖書(shū)封面 |  | 描述 | .Micro- and Opto-Electronic Materials and Structures: .Physics, Mechanics, Design, Reliability, Packaging.?is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art?and present?new information on recently developed important methods or devices.???Furthermore, ?practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices.? The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions....Volume I. focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. .Volume II. deals with various practical aspects of reliability and packagi | 出版日期 | Book 2007 | 關(guān)鍵詞 | Helium-Atom-Streuung; coating; electronics; integrated circuit; interconnect; laser; metal; microelectromec | 版次 | 1 | doi | https://doi.org/10.1007/0-387-32989-7 | isbn_softcover | 978-1-4899-7885-1 | isbn_ebook | 978-0-387-32989-5 | copyright | Springer-Verlag US 2007 |
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書(shū)目名稱Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packag影響因子(影響力) 
書(shū)目名稱Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packag影響因子(影響力)學(xué)科排名 
書(shū)目名稱Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packag網(wǎng)絡(luò)公開(kāi)度 
書(shū)目名稱Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packag網(wǎng)絡(luò)公開(kāi)度學(xué)科排名 
書(shū)目名稱Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packag被引頻次 
書(shū)目名稱Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packag被引頻次學(xué)科排名 
書(shū)目名稱Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packag年度引用 
書(shū)目名稱Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packag年度引用學(xué)科排名 
書(shū)目名稱Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packag讀者反饋 
書(shū)目名稱Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packag讀者反饋學(xué)科排名 
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