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Titlebook: Methode zur Gestaltung zukunftsrobuster modularer Produktstrukturen aus Markt- und Produktionssicht; Erik Greve Book 2023 Der/die Herausge

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發(fā)表于 2025-3-23 12:02:35 | 只看該作者
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Validierung der Methode,ischen als Teilsystem einer La-serbearbeitungsanlage unter Anwendung der Methode zukunftsrobust umgestaltet. Die Evaluation erfolgt anhand von Prüfhypothesen, welche sich aus dem abgeleiteten Forschungsbedarf des dritten Kapitels ergeben.
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acteristics of these components or devices. Now, we are well into the modern data-driven information age, having an abundance of Internet-connected devices that use components that are manufactured with specialty, critical, and/or engineered materials.
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Erik Grevelignment on various semiconductor substrates. A conduction band offset value of 2.1?eV has been obtained by internal photoemission for Lu.O. films grown on Si, Ge, and GaAs. X-ray photoelectron spectroscopy measurements of the valence band offset were performed on Ge/Lu.O. heterojunction. The result
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發(fā)表于 2025-3-24 22:21:54 | 只看該作者
Erik Greveations showed that the number of faults clearly increased at 750°C on the Sm.Co. phase which precipitated from the SmCo. alloy. The measurements indicated that the SmCo. shows the maximum amount of irreversible magnetic loss at 750°C. In addition, some multi-faults area with very low anisotropy exis
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發(fā)表于 2025-3-25 01:30:17 | 只看該作者
Erik Greveations showed that the number of faults clearly increased at 750°C on the Sm.Co. phase which precipitated from the SmCo. alloy. The measurements indicated that the SmCo. shows the maximum amount of irreversible magnetic loss at 750°C. In addition, some multi-faults area with very low anisotropy exis
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