Titlebook: Metallization of Polymers 2; Edward Sacher Book 2002 Springer Science+Business Media New York 2002 Adsorption.Compound.UV.metal.morphology

FIG

Plasma-Polymerized Fluoropolymer Thin Films for Microelectronic Applicationsent demands on materials performance for such applications as the line-to-line capacitance of interlayer dielectrics (ILD).. The ‘National Technology Roadmap for Semiconductors (NTRS) -Technology Needs’, released by the Semiconductor Manufacturing Technology Consortium (SEMATECH) and sponsored by th

stressors

Fundamental Aspects of Polymer Metallizationintensive research throughout the last decades.. In view of the great need for further miniaturization and reduction of propagation delay in future device generations aluminum will increasingly be replaced by the lower resistivity copper, and polymers are seen as potential low-permittivity (low-k) d

CYN

The Study of Copper Clusters on Dow Cyclotene and Their Stabilityh mechanisms, cluster stability and electronic structure. More recently, it was found. that many, if not most, evaporated metals deposit onto low energy surfaces, such as low permittivity polymers, in this fashion, making this wealth of previous work. available to aid in the understanding of this pr

patella

Adsorption of Noble Metal Atoms on Polymersorage. A detailed understanding of the metal/polymer interface properties plays a key role in most applications of metallized polymers. During the last few years, much work has been performed to study the different aspects of metal/polymer interface formation using various microscopic and surface-se

弄臟

Lipoma

Morphological Investigations of Low-k Polymer/Diffusion Barrier Interfaces for IC Metallizationtransistor) size scaling. However, as the IC critical dimension (CD) shrinks, interconnect latency has emerged as a primary performance driver. This has hastened the integration of copper and low-k dielectrics in back-end processing to reduce the effective signal propagation delays associated with o

Provenance

得體

Capabilities and Limitations of RBS to Characterize Hyper-Thin Silicon Compound Layers on Various Pofood and pharmaceutical packaging industries [1,2], and more recently in encapsulation of organic-based displays [3]. Their usual purpose is to act as gas barriers, reducing by up to three orders of magnitude (or even more) the undesirable permeation of gases and vapours (O., CO., H.O) through polym

Jargon

encyclopedia

Plasma and VUV Pretreatments of Polymer Surfaces for Adhesion Enhancement of Electrolessly Depositedlevel interconnects, printed circuit boards and shielded materials.. For such technological applications, electroless deposition is the most widely used method in practice today.. Basically, electroless plating is an autocatalytic redox process occurring in aqueous solution between ions of the metal