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Titlebook: Metallization of Polymers 2; Edward Sacher Book 2002 Springer Science+Business Media New York 2002 Adsorption.Compound.UV.metal.morphology

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發(fā)表于 2025-3-23 13:42:57 | 只看該作者
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發(fā)表于 2025-3-23 21:59:15 | 只看該作者
Peter Abramowitz,Junjun Liu,Michael Kiene,Paul S. Ho,Jay ImA–protein interactions. Finally, we will summarize recent approaches using direct RNA nanopore sequencing in conjunction with chemical probing to obtain RNA structural profiles at high-throughput. Nanopore technology is well positioned to address the needs for single-molecule, high-throughput RNA de
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發(fā)表于 2025-3-24 00:25:17 | 只看該作者
G. Dennler,A. Houdayer,P. Raynaud,Y. Ségui,M. R. Wertheimerpment of spray-induced gene silencing (SIGS), an innovative crop protection strategy involving the foliar application of RNAs which target and silence fungal virulence genes for plant protection against fungal pathogens. The effectiveness of SIGS is largely dependent on the ability of fungi to take
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發(fā)表于 2025-3-24 08:43:43 | 只看該作者
i.e., the mRNA transferome) in one population of mammalian cells following co-culture with another population. After co-culture, the individual cell populations are sorted by magnetic bead-mediated cell sorting and the transferred RNAs are then identified by downstream analysis methods, such as RNA
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發(fā)表于 2025-3-24 13:12:17 | 只看該作者
Plasma-Polymerized Fluoropolymer Thin Films for Microelectronic Applicationspper and copper processing. A suitable low permittivity material (low . dielectric) for near future needs has yet to be found because, according to NTRS, “Materials that simultaneously meet the electrical, mechanical and thermal requirements have been elusive”. Fluoropolymers have low permittivities
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發(fā)表于 2025-3-24 16:41:00 | 只看該作者
Morphological Investigations of Low-k Polymer/Diffusion Barrier Interfaces for IC Metallizationdmap for Semiconductors calls for barrier-layer thickness less than 10 nm prior to the 100 nm device node.. Consequently, new material sets are being investigated to provide chemically, electrically, and thermally stable barriers against Cu diffusion that maintain satisfactory performance at such lo
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發(fā)表于 2025-3-24 19:13:38 | 只看該作者
Surface Modification by Ion Assisted Reactionone by the combination of a low energy ion beam and reactive gas environment, and they named this surface modification method “Ion Assisted Reaction (IAR)”. They also reported that the activated polymer surfaces irradiated by energetic ions induce a chemical reaction with reactive gas, and new forme
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發(fā)表于 2025-3-25 02:11:08 | 只看該作者
Plasma and VUV Pretreatments of Polymer Surfaces for Adhesion Enhancement of Electrolessly Deposited procedure involving substrate treatment successively in dilute SnC1. (sensitization step) and PdC1. (activation step) acidic solutions. Further, a one-step procedure using a colloidal suspension containing both Sn and Pd species (a SnC1./PdC1. acidic solution) has been developed and is presently in
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