Titlebook: Metalle; Struktur und Eigensc Erhard Hornbogen,Hans Warlimont Book 20166th edition Springer-Verlag Berlin Heidelberg 2016 Gusswerkstoff.H?r

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書目名稱Metalle影響因子(影響力)

書目名稱Metalle影響因子(影響力)學(xué)科排名

書目名稱Metalle網(wǎng)絡(luò)公開度

書目名稱Metalle網(wǎng)絡(luò)公開度學(xué)科排名

書目名稱Metalle被引頻次

書目名稱Metalle被引頻次學(xué)科排名

書目名稱Metalle年度引用

書目名稱Metalle年度引用學(xué)科排名

書目名稱Metalle讀者反饋

書目名稱Metalle讀者反饋學(xué)科排名

只看該作者 · 發(fā)表于 2025-3-22 00:14:36

Erhard Hornbogen,Hans Warlimontward and reflected power levels. A typical solid-state RF (SSRF) generation system is comprised of a small-signal generation section, a high-power amplifier connected to a heat sink, and a power supply to drive the respective electronics [.]. The feedback, which is typically built into the powerampl

只看該作者 · 發(fā)表于 2025-3-22 03:06:35

Erhard Hornbogen,Hans Warlimontward and reflected power levels. A typical solid-state RF (SSRF) generation system is comprised of a small-signal generation section, a high-power amplifier connected to a heat sink, and a power supply to drive the respective electronics [.]. The feedback, which is typically built into the powerampl

只看該作者 · 發(fā)表于 2025-3-22 06:21:28

Erhard Hornbogen,Hans Warlimontalyses involving intermodulation, interferer blocking, spectrum regrowth and modulation..- Approaches for specifying RF ASICs on which mobile systems are built..- AGC systems, ADC dynamic range consideration and power management are addressed..- In-depth treatment of both theoretical and practical a

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只看該作者 · 發(fā)表于 2025-3-22 14:22:10

Erhard Hornbogen,Hans Warlimontalyses involving intermodulation, interferer blocking, spectrum regrowth and modulation..- Approaches for specifying RF ASICs on which mobile systems are built..- AGC systems, ADC dynamic range consideration and power management are addressed..- In-depth treatment of both theoretical and practical a

只看該作者 · 發(fā)表于 2025-3-22 17:24:40

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只看該作者 · 發(fā)表于 2025-3-23 09:33:17

Erhard Hornbogen,Hans Warlimont new environmental regulations like ROHS, WEEE and REACH take effect, the necessary cost and performance tradeoffs have to be made to stay competitive in the global market..This chapter discusses the material properties of various substrates and options to meet packaging density and performance need

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