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Titlebook: Measure of the Moon; Proceedings of the S Zdeněk Kopal,Constantine L. Goudas Conference proceedings 1967 D. Reidel Publishing Company 1967

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書(shū)目名稱(chēng)Measure of the Moon
副標(biāo)題Proceedings of the S
編輯Zdeněk Kopal,Constantine L. Goudas
視頻videohttp://file.papertrans.cn/629/628063/628063.mp4
叢書(shū)名稱(chēng)Astrophysics and Space Science Library
圖書(shū)封面Titlebook: Measure of the Moon; Proceedings of the S Zdeněk Kopal,Constantine L. Goudas Conference proceedings 1967 D. Reidel Publishing Company 1967
描述After many decades spent in astronomical semi-obscurity, the Moon has of late suddenly emerged to claim renewed interest on the part of the students of astronomy, as well as of other branches of physical science and technology; and the reasons which brought this about are indeed of historical significance. From time immemorial, astronomy has been debarred from the status of a gen- uine experimental science by the utter remoteness of the objects of its study. With the exception of meteors - those small freaks of cosmic matter intercepted by the Earth on its perpetual journey through space - the properties of all celestial bodies outside the gravitational confines of our planet could be studied only at a distance: namely, from the effect of attraction exerted by their masses; or from the ciphered message of their light brought to us by nimble-footed photons across the intervening gaps of space. A dramatic emergence of long-range rockets in the last decade bids fair to bring about a profound change in this situation. On September 13, 1959 - a memorable date in the history of human endeavour - a man-made missile of Russian origin crash- landed on the surface of the Moon in the region o
出版日期Conference proceedings 1967
關(guān)鍵詞LOPES; Libration; gravitation; solar
版次1
doihttps://doi.org/10.1007/978-94-010-3529-3
isbn_softcover978-94-010-3531-6
isbn_ebook978-94-010-3529-3Series ISSN 0067-0057 Series E-ISSN 2214-7985
issn_series 0067-0057
copyrightD. Reidel Publishing Company 1967
The information of publication is updating

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d electronics progresses (along with the optical tech- nology), the boundary where OTDM becomes more convenient than ETDM is still blurred and is a time-dependent variable. While the main design guidelines for 978-1-85233-641-7978-1-4471-0525-1
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d electronics progresses (along with the optical tech- nology), the boundary where OTDM becomes more convenient than ETDM is still blurred and is a time-dependent variable. While the main design guidelines for 978-1-85233-641-7978-1-4471-0525-1
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G. Colombois however still in competition with Electronic TDM (ETDM), and as technology in integrated electronics progresses (along with the optical tech- nology), the boundary where OTDM becomes more convenient than ETDM is still blurred and is a time-dependent variable. While the main design guidelines for
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J. Mietelski between the computational mechanics code — ., and the design optimisation tool — .. Simulations will predict the thermal mismatch between the different materials in the assembly (i.e. silicon chip and printed circuit board) — resulting in high shear strains across the solder interconnects, and used
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