Titlebook: Materials and Processes of Electron Devices; Werkstoffe und Verfa Max Knoll Book 1959 Springer-Verlag OHG., Berlin G?ttingen/Heidelberg 195

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Joining of Metal Parts, of the smallest quantity of metal necessary, ease of outgassing, and low vapor pressure of the metals concerned. These considerations have led to the fact that welding is very often considered preferable to soldering or mechanical connections. Fig. 10/1 indicates schematically the methods of joining metal as used in vacuum technique.

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https://doi.org/10.1007/978-3-642-45936-8Elektronik; Elektronisches Ger?t; Materials; Patent; Processes of Electron Devices; Verfahren; Werkstoff; d