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Titlebook: Materials and Processes for Surface and Interface Engineering; Yves Pauleau Book 1995 Springer Science+Business Media Dordrecht 1995 envir

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發(fā)表于 2025-3-23 13:25:55 | 只看該作者
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發(fā)表于 2025-3-23 20:05:02 | 只看該作者
Plasma and Discharge Physics for Materials Processing,arge area substrates, micro-machine sensors, and fabricate nanoscale particles. Plasma processing is absolutely critical to the semiconductor industry for microelectronics fabrication, but of major or growing importance in aerospace, automotive and ceramics industries [1]. In this review article, we
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發(fā)表于 2025-3-24 00:07:50 | 只看該作者
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發(fā)表于 2025-3-24 04:43:24 | 只看該作者
Ion-Surface Interactions: Collisional Sputtering, Thermal Sputtering, Ion-Beam Mixing, Compositionall discover that the underlying mechanisms are related to a surprising extent. Thus one will recognize two categories of ballistic effect, tentative thermal-spike effects, effects due to randomly moving residual defects (previously grouped in the categories . and . [1.1]), effects due to chemically
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發(fā)表于 2025-3-24 07:31:33 | 只看該作者
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發(fā)表于 2025-3-24 11:33:03 | 只看該作者
The Science, Technology and Materials Applications of Physical Vapor Deposition Processes, film and surface processing and properties of materials. Increasingly, surfaces, surface coatings and thin films play a dominant role in determining the reliability, effectiveness and application of material components. The use of multilayer and multicomponent material systems range in application
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發(fā)表于 2025-3-24 16:38:35 | 只看該作者
,Conventional and Novel Chemical Vapor Deposition Techniques — Coating Methods to Protect Materials rachloride and ammonium chloride reacted in a quartz tube at 1000 K and formed a Ti-N compound He wrote 1858 /1/ originally in German: “A further observation can be added to those that Deville and I have made on the strange affinity between nitrogen and titanium: If the vapor of liquid titanium chlo
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發(fā)表于 2025-3-24 21:04:57 | 只看該作者
Plasma Spray, Detonation Gun, and HVOF Deposition Techniques,mposing (including most metallics, ceramics, cermets, and some polymerics) to metallic and other substrates without significantly heating the substrate. Thus, for example, an oxide with a melting point well over 3000°F can be applied to a low melting point alloy such as aluminum without heating the
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發(fā)表于 2025-3-25 02:45:34 | 只看該作者
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