Titlebook: Magnetic Bubble Technology; Andrew H. Eschenfelder Book 1981Latest edition Springer-Verlag Berlin Heidelberg 1981 Magnetische Blase.Sensor

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書目名稱Magnetic Bubble Technology影響因子(影響力)




書目名稱Magnetic Bubble Technology影響因子(影響力)學(xué)科排名




書目名稱Magnetic Bubble Technology網(wǎng)絡(luò)公開度




書目名稱Magnetic Bubble Technology網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱Magnetic Bubble Technology被引頻次




書目名稱Magnetic Bubble Technology被引頻次學(xué)科排名




書目名稱Magnetic Bubble Technology年度引用




書目名稱Magnetic Bubble Technology年度引用學(xué)科排名




書目名稱Magnetic Bubble Technology讀者反饋




書目名稱Magnetic Bubble Technology讀者反饋學(xué)科排名

比目魚

Other Bubble Device Forms, for a given lithography, which is specified by the minimum feature, ., that can be realiably defined thereby. In PB devices the minimum feature is the gap, ., so that ., The density is determined by the pit pattern period, . and . is limited by . = 4?5. where . = .. Four approaches to decreasing . and increasing density for a given . are:

協(xié)奏曲

confide

打谷工具

Applications,r existing devices. On the other hand, enough application work has to be done to demonstrate the product potential before the investment will be made to develop and produce product level devices. At the time of this writing the situation with bubble technology is as follows:

開玩笑

Chip Packaging,ices. First we identify the ingredients, peculiar to bubble chips, that must be supplied by the packaging and then how those ingredients are distributed in the several levels of the packaging hierarchy (module, card, board). We will pay particular attention to the factors that limit the chip area which can be included in a single module.

云狀

Schlemms-Canal

虛度

0171-1873 magnetic bubble technology. We are pleased that the readers have found that this book satisfies that need. It has been used as a text for courses in both universities and industry, and as a reference manual by workers active in the field. To meet the need for more copies of the book it seemed prefer

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