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Titlebook: MEMS Product Development; From Concept to Comm Alissa M. Fitzgerald,Carolyn D. White,Charles C. C Book 2021 The Editor(s) (if applicable) a

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樓主: 可怖
11#
發(fā)表于 2025-3-23 12:04:37 | 只看該作者
Economics of Semiconductor Device Manufacturing and Impacts on MEMS Product Developmentfrom other semiconductor devices, and these differences impact MEMS device development. This chapter discusses the semiconductor device manufacturing infrastructure and highlights?ways MEMS device manufacture is both?similar and different.
12#
發(fā)表于 2025-3-23 14:47:49 | 只看該作者
Stages of MEMS Product Developmentbreakthrough product or a next-generation design of an existing product, your product must go through multiple stages of development to achieve commercialization. This chapter outlines the significance and the challenges of five stages of MEMS product development: proof-of-concept prototype, advance
13#
發(fā)表于 2025-3-23 22:01:43 | 只看該作者
14#
發(fā)表于 2025-3-23 22:50:45 | 只看該作者
Is There a Business Opportunity? Product Unit Cost Modelingblish the viability of a future business that must profit from selling its MEMS product. Although this chapter focuses on unit cost models for MEMS devices, the content will also be applicable to modeling any wafer-manufactured product, such as semiconductor, photonic, or nanotechnology devices.
15#
發(fā)表于 2025-3-24 05:18:49 | 只看該作者
16#
發(fā)表于 2025-3-24 07:16:12 | 只看該作者
17#
發(fā)表于 2025-3-24 14:09:03 | 只看該作者
18#
發(fā)表于 2025-3-24 18:43:52 | 只看該作者
Starting a New MEMS Device Design pieces of the MEMS product system, such as the package and electronics. We describe how to use analytical models to efficiently estimate the design space of a novel device and thereby assess feasibility in the context of practical manufacturing and operational limits. We also describe when and how
19#
發(fā)表于 2025-3-24 22:49:57 | 只看該作者
Design for Back-end-of-Line Processesrequirements on the MEMS die design and wafer layout, which are best accommodated in the early development stages. This chapter describes BEOL activities and points out some of the requirements imposed on MEMS die design and wafer layout.
20#
發(fā)表于 2025-3-25 02:41:31 | 只看該作者
Planning a Development Test Programrent types of test, including development test, manufacturing test, and qualification test. The chapter then discusses identifying test requirements, establishing test capability, and strategies for failure analysis during development.
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