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Titlebook: Long-Term Reliability of Nanometer VLSI Systems; Modeling, Analysis a Sheldon Tan,Mehdi Tahoori,Saman Kiamehr Book 2019 Springer Nature Swi

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發(fā)表于 2025-3-21 19:30:51 | 只看該作者 |倒序瀏覽 |閱讀模式
書目名稱Long-Term Reliability of Nanometer VLSI Systems
副標題Modeling, Analysis a
編輯Sheldon Tan,Mehdi Tahoori,Saman Kiamehr
視頻videohttp://file.papertrans.cn/589/588579/588579.mp4
概述Reviews classic Electromigration (EM) models, as well as existing EM failure models and discusses the limitations of those models.Introduces a dynamic EM model to address transient stress evolution, i
圖書封面Titlebook: Long-Term Reliability of Nanometer VLSI Systems; Modeling, Analysis a Sheldon Tan,Mehdi Tahoori,Saman Kiamehr Book 2019 Springer Nature Swi
描述This book provides readers with a detailed reference regarding two of the most important long-term reliability and aging effects on nanometer integrated systems, electromigrations (EM) for interconnect and biased temperature instability (BTI) for CMOS devices.? The authors discuss in detail recent developments in the modeling, analysis and optimization of the reliability effects from EM and BTI induced failures at the circuit, architecture and system levels of abstraction.? Readers will benefit from a focus on topics such as recently developed, physics-based EM modeling, EM modeling for multi-segment wires, new EM-aware power grid analysis, and system level EM-induced reliability optimization and management techniques..Reviews classic Electromigration (EM) models, as well as existing EM failure models and discusses the limitations of those models;.Introduces a dynamic EM model to address transient stress evolution, in which wires are stressed under time-varying current flows, and the EM recovery effects. Also includes new, parameterized equivalent DC current based EM models to address the recovery and transient effects;.Presents a cross-layer approach to transistor aging modeling,
出版日期Book 2019
關(guān)鍵詞Reliability in nanometer integrated systems; Bias Temperature Instability for Devices and Circuits; El
版次1
doihttps://doi.org/10.1007/978-3-030-26172-6
isbn_softcover978-3-030-26174-0
isbn_ebook978-3-030-26172-6
copyrightSpringer Nature Switzerland AG 2019
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http://image.papertrans.cn/l/image/588579.jpg
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https://doi.org/10.1007/978-3-030-26172-6Reliability in nanometer integrated systems; Bias Temperature Instability for Devices and Circuits; El
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Aging-Aware Standard Cell Library Optimization MethodsWhile the focus of the previous chapters was the modeling of reliability, the focus of the following chapters is to design reliable cells and circuits in order to mitigate the aging effect.
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Aging Guardband Reduction Through Selective Flip-Flop OptimizationModern VLSI circuits are influenced by several sources of process and runtime variabilities, including transistor aging. Therefore, it is necessary to employ techniques to consider and control the gradual degradations and mismatches during design time, e.g., by adding appropriate timing margins (.) and incorporating mitigation techniques.
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978-3-030-26174-0Springer Nature Switzerland AG 2019
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Book 2019 transient stress evolution, in which wires are stressed under time-varying current flows, and the EM recovery effects. Also includes new, parameterized equivalent DC current based EM models to address the recovery and transient effects;.Presents a cross-layer approach to transistor aging modeling,
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