Titlebook: Laser Processing and Chemistry; Dieter B?uerle Book 19962nd edition Springer-Verlag Berlin Heidelberg 1996 Materials processing.coating.la

EFFCT

書目名稱Laser Processing and Chemistry影響因子(影響力)




書目名稱Laser Processing and Chemistry影響因子(影響力)學(xué)科排名




書目名稱Laser Processing and Chemistry網(wǎng)絡(luò)公開度




書目名稱Laser Processing and Chemistry網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱Laser Processing and Chemistry被引頻次




書目名稱Laser Processing and Chemistry被引頻次學(xué)科排名




書目名稱Laser Processing and Chemistry年度引用




書目名稱Laser Processing and Chemistry年度引用學(xué)科排名




書目名稱Laser Processing and Chemistry讀者反饋




書目名稱Laser Processing and Chemistry讀者反饋學(xué)科排名

Colonnade

楓樹

General Solutions of the Heat Equationsolving the . heat equation (2.2.1). For . (uniform) irradiation, the temperature is uniform within planes . = const., and the temperature rise, Δ.(.,.), can be calculated by solving the . heat equation.

Override

CAND

Book 19962nd editionterfaces. Starting with the background physics, the book proceeds to examine applications of laser techniques in micro-machining, and the patterning, coating, and modification of material surfaces. Students, engineers, and manufacturers alike will find this book an invaluable reference work for the state of the art in laser processing.

amplitude

感激小女

gard to laser material processing. Special attention is given to laser-induced physical and chemical processes at gas--solid, liquid--solid, and solid--solid interfaces. Starting with the background physics, the book proceeds to examine applications of laser techniques in micro-machining, and the pa

同步左右

ANTIC

緊張過(guò)度

Pulsed-Laser Ablationtive with respect to the fundamental mechanisms involved in the process. Pulsed-laser ablation permits one to widely suppress the dissipation of the excitation energy beyond the volume that is ablated during the pulse.