Titlebook: Interconnects in VLSI Design; Hartmut Grabinski Book 2000 Springer Science+Business Media Dordrecht 2000 Analysis.CMOS.FPGA.Field Programm

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Electrical Performance of Capacitors Integrated in Multi-Layered Printed Circuit Boards,lts performed on test components. Several designs have been compared with respect to their electrical behaviour. In particular several via hole connections that cause the parasitic behaviour have been studied. This work is being carried out under a European Brite-EuRAM funded project, COMPRISE (BE 9

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Characteristic Impedance Measurement on Silicon,en when contact-pad capacitance and conductance are large. We demonstrate the method on a coplanar waveguide fabricated on fused silica and a microstrip line fabricated on a highly conductive silicon substrate.

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Efficient Computation of the Parameters of Parallel Transmission Lines in IC Interconnects, quasi-TEM analysis which accounts for imperfect conductors and layered lossy dielectrics. The problem is formulated in terms of two scalar potentials, which are combined to obtain modes and associated propagation constants..The focus on conductors with rectangular cross section and planar dielectri

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BiCMOS Receiver OEIC for Optical Interconnects,eceiver shows rise and fall times of less than 1 ns which are sufficient for data rates in excess of 531 MBit/s. The circuit is realized in standard 0.8 μm BiCMOS technology and can be applied in optical interconnects and in short range optical data links.

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equal standing. Recently, there has been renewed interest into the physiology of GIP in humans, and thus it is possible that DP IV resistant GIP analogues will be administered to human diabetics, perhaps reconciling differences between clinical and pre-clinical studies. Development of injection-deli

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