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Titlebook: Interconnect Technologies for Integrated Circuits and Flexible Electronics; Yash Agrawal,Kavicharan Mummaneni,P. Uma Sathyakam Book 2024 T

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書目名稱Interconnect Technologies for Integrated Circuits and Flexible Electronics
編輯Yash Agrawal,Kavicharan Mummaneni,P. Uma Sathyakam
視頻videohttp://file.papertrans.cn/471/470687/470687.mp4
概述Focuses on the investigation of advanced on-chip interconnects to match the current and future technology requirements.Enriches understanding by including contributions from leading experts across the
叢書名稱Springer Tracts in Electrical and Electronics Engineering
圖書封面Titlebook: Interconnect Technologies for Integrated Circuits and Flexible Electronics;  Yash Agrawal,Kavicharan Mummaneni,P. Uma Sathyakam Book 2024 T
描述.This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies..
出版日期Book 2024
關(guān)鍵詞Interconnects; Graphene Nanoribbon; Carbon Nanotube; Integrated Circuits; Signal Integrity; Modelling; FDT
版次1
doihttps://doi.org/10.1007/978-981-99-4476-7
isbn_softcover978-981-99-4478-1
isbn_ebook978-981-99-4476-7Series ISSN 2731-4200 Series E-ISSN 2731-4219
issn_series 2731-4200
copyrightThe Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapor
The information of publication is updating

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Emerging Interconnect Technologies for Integrated Circuits and Flexible Electronics,d serializer/deserializer, memory and printed/flexible electronics is presented. The chapter offers a comprehensive overview of the most significant trends and advancements in high-speed electronics, making it an indispensable resource for designers and engineers in the field.
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,PAM3: History, Algorithm, and?Performance Comparison to?NRZ and PAM4, under the influences of five major channel impairments, with NRZ and PAM4 as comparisons. The work reveals that PAM3 has a certain performance advantage over NRZ and PAM4 in terms of reflection coefficient, insertion loss, and mode conversion, while being relatively more sensitive to crosstalk and noise.
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Flexible Sensors for Plant Disease Monitoring,per, we described the reported work for sensing the aforementioned parameters on the flexible substrates. The emphasis has been given on the fabrication of these sensors and their sensor transfer function such as sensitivity, response time, stability, and hysteresis.
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