Titlebook: Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation; 13th International W Jorge Juan Chico,Enrico

苦惱

State Encoding for Low-Power FSMs in FPGAc [1] shows that binary encoding produces best results for small FSMs (up to 8 states) while one-hot encoding produces best results for large FSMs (over 16 states). Departing from these results, we analyze other encoding alternatives that specifically take into account state transition probabilities

FACT

Reduced Leverage of Dual Supply Voltages in Ultra Deep Submicron Technologies summarize the basic idea of this approach, its benefit and associated costs and outline the dependency of DSV on technology and device parameters. We then evaluate the use of DSV on gate level in the context of the evolving ultra deep submicron (UDSM) technology. Employing DSV exhibits a reduced le

現(xiàn)存

A Compact Charge-Based Crosstalk Induced Delay Model for Submicronic CMOS GatesCMOS gates. Crosstalk delay is described as an additional charge to be transferred through the pMOS (nMOS) network of the gate driving the victim node during its rising (falling) output transition. The model accounts for time skew between the victim and aggressor input transitions and includes submi

CRAFT

xanthelasma

Process Characterisation for Low VTH and Low Power Designs on a few of the issues that are essential when starting a low VTH or low power design, where the bottom line is a well controlled process technology and the existence of a comprehensive Process Design Kit with accurate SPICE models which include device mismatch parameters and noise parameters. The

瑣碎

Ige326

Effects of Temperature in Deep-Submicron Global Interconnect Optimizationnce is affected by the temperature in a sizeable proportion. In this paper we evaluate thermal effects in global . interconnects and quantify their impact in a standard optimization procedure in which repeaters are used. By evaluating the difference between a simple . and an accurate . model, we sho

countenance

Interconnect Parasitic Extraction Tool for Radio-Frequency Integrated Circuits detailed RLC wire model together with a distributed RC substrate model. Wire geometry is fractured to ensure accurate modeling of wave propagation as well as displacement current due to substrate losses. The wire model includes resistance and coupled capacitance together with self and mutual induct

旋轉(zhuǎn)一周

Estimation of Crosstalk Noise for On-Chip Busesof the model enables its usage in complex systems where high simulation speed is essential. The model also combines together properties such as inductive coupling, initial conditions, signal rise time, switching time and bit patterns that haven’t been included in a single analytical crosstalk model

implore