| 書目名稱 | Integrated Circuit Packaging, Assembly and Interconnections | | 編輯 | William J. Greig | | 視頻video | http://file.papertrans.cn/469/468450/468450.mp4 | | 概述 | Delivers the information designers need to implement the right packaging approach for their specific application.Explains tradeoffs to be made at each level of packaging to form the most reliable prod | | 圖書封面 |  | | 描述 | .Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC...The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes...Integrated Circuit Packaging, Assembly and Interconnections. is an introduction, a review and an update of packaging technologies.. | | 出版日期 | Book 2007 | | 關(guān)鍵詞 | circuit; integrated circuit; manufacturing; material; packaging; thin films | | 版次 | 1 | | doi | https://doi.org/10.1007/0-387-33913-2 | | isbn_softcover | 978-1-4419-3923-4 | | isbn_ebook | 978-0-387-33913-9 | | copyright | Springer-Verlag US 2007 |
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書目名稱Integrated Circuit Packaging, Assembly and Interconnections影響因子(影響力)
書目名稱Integrated Circuit Packaging, Assembly and Interconnections影響因子(影響力)學(xué)科排名
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書目名稱Integrated Circuit Packaging, Assembly and Interconnections網(wǎng)絡(luò)公開度學(xué)科排名
書目名稱Integrated Circuit Packaging, Assembly and Interconnections被引頻次
書目名稱Integrated Circuit Packaging, Assembly and Interconnections被引頻次學(xué)科排名
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書目名稱Integrated Circuit Packaging, Assembly and Interconnections年度引用學(xué)科排名
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書目名稱Integrated Circuit Packaging, Assembly and Interconnections讀者反饋學(xué)科排名
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