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Titlebook: Hf-Based High-k Dielectrics; Process Development, Young-Hee Kim,Jack C. Lee Book 2005 Springer Nature Switzerland AG 2005

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發(fā)表于 2025-3-21 19:34:00 | 只看該作者 |倒序瀏覽 |閱讀模式
書目名稱Hf-Based High-k Dielectrics
副標題Process Development,
編輯Young-Hee Kim,Jack C. Lee
視頻videohttp://file.papertrans.cn/427/426083/426083.mp4
叢書名稱Synthesis Lectures on Solid State Materials and Devices
圖書封面Titlebook: Hf-Based High-k Dielectrics; Process Development, Young-Hee Kim,Jack C. Lee Book 2005 Springer Nature Switzerland AG 2005
描述In this work, the reliability of HfO2 (hafnium oxide) with poly gate and dual metal gate electrode (Ru–Ta alloy, Ru) was investigated. Hard breakdown and soft breakdown, particularly the Weibull slopes, were studied under constant voltage stress. Dynamic stressing has also been used. It was found that the combination of trapping and detrapping contributed to the enhancement of the projected lifetime. The results from the polarity dependence studies showed that the substrate injection exhibited a shorter projected lifetime and worse soft breakdown behavior, compared to the gate injection. The origin of soft breakdown (first breakdown) was studied and the results suggested that the soft breakdown may be due to one layer breakdown in the bilayer structure (HfO2/SiO2: 4 nm/4 nm). Low Weibull slope was in part attributed to the lower barrier height of HfO2 at the interface layer. Interface layer optimization was conducted in terms of mobility, swing, and short channel effect using deep submicron MOSFET devices.
出版日期Book 2005
版次1
doihttps://doi.org/10.1007/978-3-031-02552-5
isbn_softcover978-3-031-01424-6
isbn_ebook978-3-031-02552-5Series ISSN 1932-1260 Series E-ISSN 1932-1724
issn_series 1932-1260
copyrightSpringer Nature Switzerland AG 2005
The information of publication is updating

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