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Titlebook: Handbook Of Electronics Packaging Design and Engineering; Bernard S. Matisoff Book 1982 Van Nostrand Reinhold Company Inc. 1982 control.de

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發(fā)表于 2025-3-21 18:43:56 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書目名稱Handbook Of Electronics Packaging Design and Engineering
編輯Bernard S. Matisoff
視頻videohttp://file.papertrans.cn/421/420729/420729.mp4
圖書封面Titlebook: Handbook Of Electronics Packaging Design and Engineering;  Bernard S. Matisoff Book 1982 Van Nostrand Reinhold Company Inc. 1982 control.de
描述The Handbook of Electronics Packaging Design and Engineering has been writ- ten as a reference source for use in the packaging design of electronics equip- ment. It is designed to provide a single convenient source for the solution of re- curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: ? Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. ? Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. ? Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting p
出版日期Book 1982
關(guān)鍵詞control; development; electronics; energy; engineer; environment; maintainability; manufacturing; materials;
版次1
doihttps://doi.org/10.1007/978-94-011-6979-0
isbn_softcover978-94-011-6981-3
isbn_ebook978-94-011-6979-0
copyrightVan Nostrand Reinhold Company Inc. 1982
The information of publication is updating

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發(fā)表于 2025-3-21 23:56:30 | 只看該作者
Handbook Of Electronics Packaging Design and Engineering978-94-011-6979-0
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J?rgen M?ller,Svend-Erik Skaaninges to be met at specific dates and then make every effort to meet them. Unforeseen problems sometimes cause setbacks in the original plan; at such times, the engineer should simply replot the original plan, noting the cause for delay, and then proceed. The history recorded during the task will be useful in estimating future tasks.
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The Rule of Reason in Antitrust Lawle to sectionalize or modularize subassemblies into a series of replaceable units, with the parts and wiring arranged to provide for maximum accessibility (Figure 8-1). Each unit should contain all of the components required to perform a specific function, such as amplifying, rectifying, frequency controlling, etc. (Figures 8-2 and 8-3).
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https://doi.org/10.1007/978-3-030-65229-6d dust are directly attributable to a large number of failures in electronics systems. In Chapters 8 and 12, equipment enclosures are discussed. The material presented in this chapter covers both organic and inorganic environmental coatings commonly used to protect materials and assemblies from harsh environmental exposure.
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https://doi.org/10.1007/978-94-015-8016-8 and applicable finishes. They present the common engineering materials and their recommended applications. Also, the applicable finishes are presented with their recommended use and their compatibility with various base materials.
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發(fā)表于 2025-3-23 06:23:11 | 只看該作者
https://doi.org/10.1007/978-1-349-03351-5s provided. The engineer and designer should use the terminology generally accepted within the industry in all forms of communication. All engineering documents should use only the standard accepted terminology.
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