找回密碼
 To register

QQ登錄

只需一步，快速開始

掃一掃，訪問微社區(qū)

打印 上一主題 下一主題

Titlebook: Handbook Of Electronics Packaging Design and Engineering; Bernard S. Matisoff Book 1990 Van Nostrand Reinhold 1990 electronics.manufacturi

[復(fù)制鏈接]
查看: 45006|回復(fù): 61
樓主
發(fā)表于 2025-3-21 16:56:32 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書目名稱Handbook Of Electronics Packaging Design and Engineering
編輯Bernard S. Matisoff
視頻videohttp://file.papertrans.cn/421/420728/420728.mp4
圖書封面Titlebook: Handbook Of Electronics Packaging Design and Engineering; Bernard S. Matisoff Book 1990 Van Nostrand Reinhold 1990 electronics.manufacturi
描述The Handbook of Electronics Packaging Design and Engineering has been writ- ten as a reference source for use in the packaging design of electronics equip- ment. It is designed to provide a single convenient source for the solution of re- curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: ? Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. ? Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. ? Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting p
出版日期Book 1990
關(guān)鍵詞electronics; manufacturing; mechanics; metals; packaging
版次1
doihttps://doi.org/10.1007/978-94-011-7047-5
isbn_softcover978-94-011-7049-9
isbn_ebook978-94-011-7047-5
copyrightVan Nostrand Reinhold 1990
The information of publication is updating

書目名稱Handbook Of Electronics Packaging Design and Engineering影響因子(影響力)




書目名稱Handbook Of Electronics Packaging Design and Engineering影響因子(影響力)學(xué)科排名




書目名稱Handbook Of Electronics Packaging Design and Engineering網(wǎng)絡(luò)公開度




書目名稱Handbook Of Electronics Packaging Design and Engineering網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱Handbook Of Electronics Packaging Design and Engineering被引頻次




書目名稱Handbook Of Electronics Packaging Design and Engineering被引頻次學(xué)科排名




書目名稱Handbook Of Electronics Packaging Design and Engineering年度引用




書目名稱Handbook Of Electronics Packaging Design and Engineering年度引用學(xué)科排名




書目名稱Handbook Of Electronics Packaging Design and Engineering讀者反饋




書目名稱Handbook Of Electronics Packaging Design and Engineering讀者反饋學(xué)科排名




單選投票, 共有 0 人參與投票
 

0票 0%

Perfect with Aesthetics
 

0票 0%

Better Implies Difficulty
 

0票 0%

Good and Satisfactory
 

0票 0%

Adverse Performance
 

0票 0%

Disdainful Garbage
您所在的用戶組沒有投票權(quán)限
沙發(fā)
發(fā)表于 2025-3-21 22:01:45 | 只看該作者
板凳
發(fā)表于 2025-3-22 04:17:31 | 只看該作者
Justus Akinsanya,Greg Cox,Lucy Fletchertary has set up certain minimum standards that can also be effectively used in commercial products. The design standards presented herein attempt to achieve the combined minimum requirements of all of the military and commercial standards in use today (Table 16-1).
地板
發(fā)表于 2025-3-22 05:10:49 | 只看該作者
Daniel Callahan,H. Tristram Engelhardt costs. This chapter provides some of the basic manufacturing procedures available and the restrictions that must be considered in designing modern electronics equipment that will be manufacturable and salable at competitive prices.
5#
發(fā)表于 2025-3-22 10:17:43 | 只看該作者
The Roper, Logan and Tierney Model in Actionth the composition of the solution, current density, agitation, and solution temperature. Hardness, conductivity, solderability, and corrosion-resistance are generally the most important plating properties, since coating-life is usually dependent upon these factors.
6#
發(fā)表于 2025-3-22 13:57:29 | 只看該作者
The Rosetta Stone of the Human Mindrd module should be capable of installation into any existing standard installation, such as a standard 19-inch EIA (Electronics Industries Association) rack and panel, ATR (air transport racking) cases (Figure 12-2), or commercial instrument cases.
7#
發(fā)表于 2025-3-22 19:05:57 | 只看該作者
8#
發(fā)表于 2025-3-23 00:59:14 | 只看該作者
9#
發(fā)表于 2025-3-23 04:53:06 | 只看該作者
10#
發(fā)表于 2025-3-23 05:45:48 | 只看該作者
 關(guān)于派博傳思  派博傳思旗下網(wǎng)站  友情鏈接
派博傳思介紹 公司地理位置 論文服務(wù)流程 影響因子官網(wǎng) 吾愛論文網(wǎng) 大講堂 北京大學(xué) Oxford Uni. Harvard Uni.
發(fā)展歷史沿革 期刊點(diǎn)評(píng) 投稿經(jīng)驗(yàn)總結(jié) SCIENCEGARD IMPACTFACTOR 派博系數(shù) 清華大學(xué) Yale Uni. Stanford Uni.
QQ|Archiver|手機(jī)版|小黑屋| 派博傳思國際 ( 京公網(wǎng)安備110108008328) GMT+8, 2025-10-15 13:32
Copyright © 2001-2015 派博傳思   京公網(wǎng)安備110108008328 版權(quán)所有 All rights reserved
快速回復(fù) 返回頂部 返回列表
磴口县| 星子县| 阿鲁科尔沁旗| 嵩明县| 灌阳县| 沂南县| 贺兰县| 福州市| 平阴县| 武汉市| 合山市| 固安县| 恭城| 阜宁县| 杭锦旗| 昌邑市| 丰镇市| 建水县| 安溪县| 汾阳市| 清水河县| 巧家县| 桐梓县| 建平县| 房产| 亚东县| 通州市| 金塔县| 博爱县| 通榆县| 陇西县| 太原市| 鹿邑县| 荣昌县| 中宁县| 延庆县| 湛江市| 安新县| 光泽县| 连城县| 塔河县|