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書目名稱Gradient Microstructure in Laser Shock Peened Materials影響因子(影響力)




書目名稱Gradient Microstructure in Laser Shock Peened Materials影響因子(影響力)學(xué)科排名




書目名稱Gradient Microstructure in Laser Shock Peened Materials網(wǎng)絡(luò)公開度




書目名稱Gradient Microstructure in Laser Shock Peened Materials網(wǎng)絡(luò)公開度學(xué)科排名




書目名稱Gradient Microstructure in Laser Shock Peened Materials被引頻次




書目名稱Gradient Microstructure in Laser Shock Peened Materials被引頻次學(xué)科排名




書目名稱Gradient Microstructure in Laser Shock Peened Materials年度引用




書目名稱Gradient Microstructure in Laser Shock Peened Materials年度引用學(xué)科排名




書目名稱Gradient Microstructure in Laser Shock Peened Materials讀者反饋




書目名稱Gradient Microstructure in Laser Shock Peened Materials讀者反饋學(xué)科排名

FLING

GUILE

宮殿般

Study on the Compound Process of LSP and the Strengthening Mechanism on Aero-Engine Blades,ity and safety of the engine. However, due to the fact that the engine always works at conditions of high temperatures and high speeds, it is prone to fatigue fracture, which seriously threatens the reliability and safety of the engine. LSP is a surface treatment technology, which can effectively im

剝削

The Independent and the Alternative, equipment failure or accidents (Namjoshi and Mall in Int. J. Fatigue 23:S455–S461, 2001 [.]). According to statistics, in the aviation field, 40% of the mechanical failures of aircraft and metal engine parts are caused by fatigue.

ostracize

Chindu Sreedharan,Einar Thorsenact on materials and induce them to produce a gradient stress field and microstructures (Chupakhin et al. in Int J Adv Manuf Technol (2019) [.]; Tsuyama et al. in Appl Phys A 124(3) (2018) [.]; Zabeen et al. in Acta Mater 83:216–226, 2015 [.]). Shock wave is the energy carrier to strengthen the mate

ostracize

https://doi.org/10.1057/9781137410696perties can effectively improve the reliability of parts and prolong the service lifetime of components (Roland et al. in Scripta Mater. 54:1949–1954, 2006 [.]; Peyreet al. in Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process. 210(1–2):(102–113), 1996 [.]).

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