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Titlebook: Global Life Cycle Impact Assessments of Material Shifts; The Example of a Lea A.S.G. Andrae Book 2010 Springer-Verlag London 2010 Conductiv

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21#
發(fā)表于 2025-3-25 04:52:26 | 只看該作者
Conclusions, of landfill Pb emissions are introduced the shift from Pb solders seems advantageous seen from a LIME environmental cost perspective. Precious metals such as Pd have a high environmental cost compared to Sn.
22#
發(fā)表于 2025-3-25 10:36:42 | 只看該作者
Looking Ahead,ed. The ecological effects of using nanotechnologies in interconnection are not clear but important to understand before a wider introduction of nanomaterials. For important technologies LCAs need to be performed continually, and not on a one-time basis.
23#
發(fā)表于 2025-3-25 13:10:39 | 只看該作者
24#
發(fā)表于 2025-3-25 16:15:33 | 只看該作者
Introduction,ve adhesives. The resource issues of tin and silver are briefly mentioned as well as the legislative Pb ban exemptions of high-melting-point Pb based solders. The differences between attributional LCA and consequential LCA are mentioned. The purpose of the book is clarified in the goal and scope sec
25#
發(fā)表于 2025-3-26 00:02:03 | 只看該作者
,Interconnection Materials – Technical Research Status,ating materials. The overview of different materials sets the scope and perspective of the following environmental life cycle assessments discussed in Chaps. 5 and 6. Solder pastes based on nanosized metal spheres are introduced. Research exploring ways to produce electronics without interconnection
26#
發(fā)表于 2025-3-26 02:50:05 | 只看該作者
27#
發(fā)表于 2025-3-26 07:49:33 | 只看該作者
Methodology,e discussed with special emphasis on the Excel-based software EMLCA. One possible methodology for performing an LCIA of interconnection materials is presented. Concerning consequential LCA, a procedure for identifying marginal consumers is proposed. This text makes a summary of the important issues
28#
發(fā)表于 2025-3-26 12:10:24 | 只看該作者
LCA Case Studies of Solders, using CLCA, LIME, and air/water toxicity factors. The life cycle inventory calculations are shown in detail for chosen examples. Using the CMLCA software Agfree solders are compared to the most common Sn–Ag–Cu combination as a starting point. The extensive interpretation capabilities of CMLCA are d
29#
發(fā)表于 2025-3-26 16:43:02 | 只看該作者
30#
發(fā)表于 2025-3-26 20:22:33 | 只看該作者
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