Titlebook: Gaseous Dielectrics IX; Loucas G. Christophorou,James K. Olthoff Book 2001 Springer Science+Business Media New York 2001 Plasma.dielectric

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Aristotle’s Theory of Practical Cognitionstudied to investigate the potentiality of rare gases as sensitive media in radiation detectors. and high energy electronic transition lasers.. In fact, rare gases have the ability to convert efficiently electron kinetic energy to electronic excitations and to convey the excitation energy to lower-l

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Restenosis

Gary Cornell,Joseph H. Silverman development of plasma processing tools where both ion energy and radical fluxes can be controlled to obtain reasonable etch rates with minimal surface damage. Recent work indicates that reactive ion etching (RIE) process optimization can be achieved primarily through a consideration of plasma elect

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The Selberg sieve for sequences,ity in integrated circuits is pushing all microelectronics manufacturing processes including plasma etching to their limits. Transition towards new materials (e.g. Cu, low-k dielectrics), control of plasma damage mechanisms (e.g. charging) and new environmentally friendly etching chemistries (e.g. C

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Stress

Berechnung von speziellen Funktionen,silicon to form volatile SiX. (X = halogen) species. Unfortunately, the most widely-used feed gas, CF., has a high global warming potential.. As a consequence, other halocarbons are being considered as replacements for CF.. Trifluoroiodomethane, CF.I, is a promising candidate: It has a low global-wa

Flat-Feet

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Dynamics of Low Energy Electron Collisions with Molecules and Clustersring phases for the relevant partial waves and the influence of temporary negative ion states (resonances).. For quite a few atoms and molecules, special behaviour of the s - wave (. = 0) phase shift leads to a deep Ramsauer-Townsend minimum in the scattering cross section between 0 and 1 eV which s

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Ion Motion in Dielectric Gasesportant as their use is their abatement (.), since gases like SF. or some perfluorocarbons are potent greenhouse gases. The above processes require that at some stage the gas be subjected to discharge conditions, which are nowadays optimized by previous modeling and process simulation, which in turn