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Titlebook: Gallium Oxide; Materials Properties Masataka Higashiwaki,Shizuo Fujita Book 2020 Springer Nature Switzerland AG 2020 Ga2O3.transparent cond

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發(fā)表于 2025-3-21 18:53:59 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書目名稱Gallium Oxide
副標(biāo)題Materials Properties
編輯Masataka Higashiwaki,Shizuo Fujita
視頻videohttp://file.papertrans.cn/381/380406/380406.mp4
概述Represents the first book dedicated to Ga2O3.Focuses on a key research area in ultra-wide-bandgap semiconductors.Provides broad coverage from materials properties through devices
叢書名稱Springer Series in Materials Science
圖書封面Titlebook: Gallium Oxide; Materials Properties Masataka Higashiwaki,Shizuo Fujita Book 2020 Springer Nature Switzerland AG 2020 Ga2O3.transparent cond
描述.This book provides comprehensive coverage of the new wide-bandgap semiconductor gallium oxide (Ga?O?). Ga?O??has been attracting much attention due to its excellent materials properties. It features an extremely large bandgap of greater than 4.5 eV and availability of large-size, high-quality native substrates produced from melt-grown bulk single crystals. Ga?O??is thus a rising star among ultra-wide-bandgap semiconductors and represents a key emerging research field for the worldwide semiconductor community..Expert chapters cover physical properties, synthesis, and state-of-the-art applications, including materials properties, growth techniques of melt-grown bulk single crystals and epitaxial thin films, and many types of devices. The book is an essential resource for academic and industry readers who have an interest in, or plan to start, a new R&D project related to Ga?O?..
出版日期Book 2020
關(guān)鍵詞Ga2O3; transparent conducting oxide; new wide-bandgap semiconductors; Gallium Oxide devices; Ga2O3 epita
版次1
doihttps://doi.org/10.1007/978-3-030-37153-1
isbn_softcover978-3-030-37155-5
isbn_ebook978-3-030-37153-1Series ISSN 0933-033X Series E-ISSN 2196-2812
issn_series 0933-033X
copyrightSpringer Nature Switzerland AG 2020
The information of publication is updating

書目名稱Gallium Oxide影響因子(影響力)




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書目名稱Gallium Oxide網(wǎng)絡(luò)公開度




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發(fā)表于 2025-3-21 22:03:31 | 只看該作者
,Ausgew?hlte Aspekte der Einführungsphase,ining a smooth surface, because it reduces segregation of Sn. By optimizing the growth conditions in this manner, one can fabricate device-quality β-Ga.O. homoepitaxial films with precisely controllable donor concentrations over a wide range (10.–10.?cm.) and atomically flat surfaces.
板凳
發(fā)表于 2025-3-22 03:44:02 | 只看該作者
地板
發(fā)表于 2025-3-22 07:46:08 | 只看該作者
5#
發(fā)表于 2025-3-22 12:01:47 | 只看該作者
Mist Chemical Vapor Deposition 2h permits rotational domains. Furthermore, the growth mechanism of these rotational domains was explained using the atomic arrangement of ε-Ga.O. and the crystal structures of the substrates. Finally, bandgap engineering from 4.5 to 5.9?eV was demonstrated via mist CVD with the incorporation of In and Al.
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發(fā)表于 2025-3-22 15:11:55 | 只看該作者
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發(fā)表于 2025-3-22 19:12:08 | 只看該作者
0933-033X m materials properties through devices.This book provides comprehensive coverage of the new wide-bandgap semiconductor gallium oxide (Ga?O?). Ga?O??has been attracting much attention due to its excellent materials properties. It features an extremely large bandgap of greater than 4.5 eV and availabi
8#
發(fā)表于 2025-3-23 00:17:30 | 只看該作者
Agiles HR Management in der Logistikiscussed. LPCVD growth of β-Ga.O. rod structures on 3C-SiC substrates is also discussed. From the crystal structural characterization and electron transport measurements, LPCVD-grown β-Ga.O. materials exhibit high quality with great promises for high power electronic and short-wavelength optoelectronic device applications.
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發(fā)表于 2025-3-23 01:35:30 | 只看該作者
David Parsons,Kathryn MacCallumn boundaries, dislocations, nanovoids, residual impurities, intentional doping, and dopant distribution. The wafer manufacturing section describes the basic wafer process and the effect of annealing on carrier concentration.
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發(fā)表于 2025-3-23 09:30:42 | 只看該作者
Floating Zone Method, Edge-Defined Film-Fed Growth Method, and Wafer Manufacturingn boundaries, dislocations, nanovoids, residual impurities, intentional doping, and dopant distribution. The wafer manufacturing section describes the basic wafer process and the effect of annealing on carrier concentration.
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