Titlebook: Fundamentals of Software Culture; Zheng Qin,Huidi Zhang,Wenhui Yu Book 2018 Springer Nature Singapore Pte Ltd. and Zhejiang University Pre

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Die Stress Measurement Using Piezoresistive Stress Sensors,ology. In the case of integrated circuit (IC) packages, stress can be produced either through the die attachment process or through encapsulation in a molding material. In the case of chip-on-board (COB) packaging, stress can be produced by the chip coating used to protect the IC against handling da

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2520-1476 ritical research on school and policy design.Examines issuesThis book addresses the relationship between the production of social problems in educational policy, the research practices required to inform policy, and the daily production of normalcies and differences in school contexts. It reports on

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