| 書(shū)目名稱(chēng) | Fundamentals of Lead-Free Solder Interconnect Technology |
| 副標(biāo)題 | From Microstructures |
| 編輯 | Tae-Kyu Lee,Thomas R. Bieler,Hongtao Ma |
| 視頻video | http://file.papertrans.cn/351/350361/350361.mp4 |
| 概述 | Provides an up-to-date overview on lead-free soldering technologies.Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering techniques.Explores emerging techn |
| 圖書(shū)封面 |  |
| 描述 | .This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.. |
| 出版日期 | Book 2015 |
| 關(guān)鍵詞 | electromigration; lead free soldering standards; lead-free electronics; lead-free solder alloys; lead-fr |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-1-4614-9266-5 |
| isbn_softcover | 978-1-4899-7801-1 |
| isbn_ebook | 978-1-4614-9266-5 |
| copyright | Springer Science+Business Media New York 2015 |
|Archiver|手機(jī)版|小黑屋|
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