| 書(shū)目名稱 | Failure Analysis of Integrated Circuits |
| 副標(biāo)題 | Tools and Techniques |
| 編輯 | Lawrence C. Wagner |
| 視頻video | http://file.papertrans.cn/341/340546/340546.mp4 |
| 叢書(shū)名稱 | The Springer International Series in Engineering and Computer Science |
| 圖書(shū)封面 |  |
| 描述 | .Failure Analysis of Integrated Circuits: Tools andTechniques. provides a basic understanding of how the most commonlyused tools and techniques in silicon-based semiconductors are appliedto understanding the root cause of electrical failures in integratedcircuits. These include applications specific to performing failureanalysis such as decapsulation, deprocessing, and fail site isolation,as well as physical and chemical analysis tools and techniques. Thecoverage is qualitative, and it provides a general understanding formaking intelligent tool choices. Also included is coverage of theshortcomings, limitations, and strengths of each technique. ..Failure Analysis of Integrated Circuits: Tools and Techniques. isa `must have‘ reference work for semiconductor professionals andresearchers. |
| 出版日期 | Book 1999 |
| 關(guān)鍵詞 | circuit; diagnosis; energy; integrated circuit; semiconductor |
| 版次 | 1 |
| doi | https://doi.org/10.1007/978-1-4615-4919-2 |
| isbn_softcover | 978-1-4613-7231-8 |
| isbn_ebook | 978-1-4615-4919-2Series ISSN 0893-3405 |
| issn_series | 0893-3405 |
| copyright | Springer Science+Business Media New York 1999 |
|Archiver|手機(jī)版|小黑屋|
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