Titlebook: Embedded Artificial Intelligence; Principles, Platform Bin Li Book 2024 Tsinghua University Press, Beijing China. 2024 Embedded Artificial

只看該作者 · 發(fā)表于 2025-3-27 09:18:35

Perspectives on Individual Differencesto various AI acceleration chips, compares its similarities and differences with the general AI application development process, and details the specific development steps for embedded AI development, such as model optimization, conversion, compilation, deployment, etc. Finally, NVIDIA Jetson is tak

只看該作者 · 發(fā)表于 2025-3-27 10:55:44

只看該作者 · 發(fā)表于 2025-3-27 15:30:28

https://doi.org/10.1007/978-981-97-5038-2Embedded Artificial Intelligence; Embedded AI; Edge AI; TinyML; Model Compression; Embedded AI Accelerato

只看該作者 · 發(fā)表于 2025-3-27 19:13:03

只看該作者 · 發(fā)表于 2025-3-27 23:04:06

Bin LiOffers a comprehensive introduction to embedded artificial intelligence with a clear and logical structure.Provides rich and in-depth coverage of embedded AI principles, platforms, and practical aspec

只看該作者 · 發(fā)表于 2025-3-28 02:37:54

只看該作者 · 發(fā)表于 2025-3-28 09:17:35

Methodologie sozialp?dagogischer ForschungThis chapter takes the development of a drone-based sun umbrella as an example and comprehensively uses the embedded AI application development process and components introduced in the previous chapters to demonstrate how to develop an embedded AI application.

只看該作者 · 發(fā)表于 2025-3-28 10:36:42

		自動(dòng)登錄	找回密碼
密碼			To register

關(guān)于派博傳思			派博傳思旗下網(wǎng)站			友情鏈接
派博傳思介紹	公司地理位置	論文服務(wù)流程	影響因子官網(wǎng)	吾愛(ài)論文網(wǎng)	大講堂	北京大學(xué)	Oxford Uni.	Harvard Uni.
發(fā)展歷史沿革	期刊點(diǎn)評(píng)	投稿經(jīng)驗(yàn)總結(jié)	SCIENCEGARD	IMPACTFACTOR	派博系數(shù)	清華大學(xué)	Yale Uni.	Stanford Uni.
\|Archiver\|手機(jī)版\|小黑屋\| 派博傳思國(guó)際 ( 京公網(wǎng)安備110108008328) GMT+8, 2025-10-7 11:14
Copyright © 2001-2015 派博傳思京公網(wǎng)安備110108008328 版權(quán)所有 All rights reserved