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Titlebook: Emerging Technologies for In Situ Processing; Daniel J. Ehrlich,Van Tran Nguyen (Director) Book 1988 Martinus Nijhoff Publishers, Dordretc

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書目名稱Emerging Technologies for In Situ Processing
編輯Daniel J. Ehrlich,Van Tran Nguyen (Director)
視頻videohttp://file.papertrans.cn/309/308423/308423.mp4
叢書名稱NATO Science Series E:
圖書封面Titlebook: Emerging Technologies for In Situ Processing;  Daniel J. Ehrlich,Van Tran Nguyen (Director) Book 1988 Martinus Nijhoff Publishers, Dordretc
出版日期Book 1988
關(guān)鍵詞Phase; Wafer; X-Ray; development; laser; liquid; manufacturing; semiconductor devices; semiconductors; thin f
版次1
doihttps://doi.org/10.1007/978-94-009-1409-4
isbn_softcover978-94-010-7130-7
isbn_ebook978-94-009-1409-4Series ISSN 0168-132X
issn_series 0168-132X
copyrightMartinus Nijhoff Publishers, Dordretch. 1988
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New World Order and Small Regions-step patterning of materials by deposition, surface modification, synthesis and etching [1,2]. The lateral dimensions of the processed regions range from several centimeters to less than one micrometer. Contrary to conventional techniques such as chemical vapor deposition (CVD), plasma deposition (
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Biogeography of New Zealand Lizards,be achieved via deposition employing a tightly focused laser beam, a number of applications for laser deposition have been found in the microelectronics field. For example, highly localized deposition induced by a scanning, focused cw laser beam has been successfully used for direct writing of inter
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New and Developing Sources of Food Proteins circuit manufacturing because they provide a unique combination of high precision, high volume and low cost. In these methods an opaque pattern on a trans-illuminated mask is imaged onto a photoresist—coated wafer. The intensity distribution in the image plane is imprinted on the wafer in two steps
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