Titlebook: Electronics Production Defects and Analysis; Oommen Tharakan Kuttiyil Thomas,Padma Padmanabhan Book 2022 The Editor(s) (if applicable) an

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書目名稱Electronics Production Defects and Analysis影響因子(影響力)




書目名稱Electronics Production Defects and Analysis影響因子(影響力)學(xué)科排名




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書目名稱Electronics Production Defects and Analysis網(wǎng)絡(luò)公開度學(xué)科排名




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書目名稱Electronics Production Defects and Analysis讀者反饋




書目名稱Electronics Production Defects and Analysis讀者反饋學(xué)科排名

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Electronics Production Defects and Analysis978-981-16-9824-8Series ISSN 2731-4200 Series E-ISSN 2731-4219

Cardiac

Socio-Markers and Information Transmissionvolved activity which comprises a multitude of tasks. Utmost attention shall be paid to each and every element and the respective production stage, in the process. This involves establishing after suitable validation soldering of miniscule electronic components, control on soldering of the paddle of

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Bjoern Oest Hansen,Jan Taubert,Thomas Thielrapment leading to conductive anodic filament formation. Also, the PTH barrel integrity can be affected if the process control measures are not strictly followed. Moreover, the solderability of the PCBs can be impaired due to the formation of thick intermetallic compound on improper storage of the f

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Hinderk M. Emrich,Michael Wiegandthe defects arising due to offset in mounting of ICs, non-standard mounting of capacitors, damaged end termination of SMT devices, lead deformation on mounting of ICs, inadequate electrical clearance and improper lead formation. The case of mounting defect due to inadequate heel in ICs has been capt

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https://doi.org/10.1007/978-1-4614-8630-5nd shock environments. The commonly used conformal coating material and their applications are tabulated. Proper cleaning of the surfaces, masking the required areas including irregular surfaces with tapes and baking shall be strictly adhered to proscribe any defects. Three typical defects encounter

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Valeria De Bedout,Anna J. Nicholss can happen probably because of non-availability of equivalent devices and substituting with near equivalent ones which need not be?form and fit although may be functionally equivalent. This results in issues such as failure to maintain adequate clearance between conductive elements, single point f