Titlebook: Electronics Packaging Forum; Volume Two James E. Morris Book 1991 Van Nostrand Reinhold 1991 circuit.development.electrical overstress (EOS

amphibian

Electrical Bonding of Connectors on Jet Engine Electronics,s. The DC resistance between these connectors and their mounting surfaces must be less than 2.5 milliohms. Electronic control systems have experienced difficulty in meeting this bonding specification after environmental stress screening. The particular interface in question is between stainless stee

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Microelectronics Packaging/Interconnect: An Industry in Transition,tial impact of changes in electronics packaging/interconnect on military systems. The findings and recommendations should be of interest to all the electronics community because the current modes of doing business in military electronics are expensive and opportunities for dual-use technology applic

paleolithic

An Introduction to Tape Automated Bonding Technology, is placed upon a new understanding of the key elements (e.g., tapes, bumps, inner lead bonding, testing and burn-in on tape-with-chip, encapsulation, outer lead bonding, thermal management, reliability, etc.) of this rapidly moving technology.

SSRIS

expansive

Low Dielectric Constant Materials for Packaging High Speed Electronics,electric field; the dielectric strength defines a limiting electric field gradient above which the interaction of the dielectric with the field causes an irreversible change in the dielectric. Values of these properties for commercially important dielectric materials are shown in Table 8.1.

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Cleaning Surface Mount Assemblies: The Challenge of Finding a Substitute for CFC-113,, and ability to azeotrope (or boil as a compound at a single temperature) with other ingredients -- especially lower molecular weight alcohols and other select ingredients --s thus enhancing its solvency power for contaminant residues.

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Microelectronics Packaging/Interconnect: An Industry in Transition,ations could extend beyond the traditional military electronics industry. Some of the comments in this presentation are the author’s opinion only and may not represent the consensus position of either the Task Force or Allied-Signal.

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maverick

Manfred Nagl,Bernhard Westfechtel versus normal force was determined for the various configurations. The results show that electroplated nickel stainless steel connectors will meet the connector to engine control bonding resistance specification of 2.5 milliohms.