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Titlebook: Electronic Properties of Multilayers and Low-Dimensional Semiconductor Structures; J. M. Chamberlain,Laurence Eaves,Jean-Claude Porta Book

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樓主: legerdemain
31#
發(fā)表于 2025-3-26 23:23:19 | 只看該作者
Spieltheoretische Verhandlungsmodelle, (B parallel to the plane of the barriers) on the resonances in I(V) is examined. Resonant tunnelling into hybrid magneto-electric states of the quantum well is observed and is interpreted using the effective mass approximation.
32#
發(fā)表于 2025-3-27 03:41:11 | 只看該作者
33#
發(fā)表于 2025-3-27 08:39:35 | 只看該作者
34#
發(fā)表于 2025-3-27 12:28:35 | 只看該作者
0258-1221 f the most active areas in modern semiconductor physics. These included resonant tunnelling and superlattice phenomena and the topics of ballistic transport, quantised conductance and anomalous magnetoresistance effects in laterally gated two-dimensional electron systems. Although the main emphasis
35#
發(fā)表于 2025-3-27 15:41:23 | 只看該作者
Informationseffizienz auf Kapitalm?rktenD plasmon resonances, intersubband resonances, minigaps and local plasmons in charge density modulated systems, dc transport and far infrared response in 1DES and 0DES as well as quantum well exciton polaritons in the photoluminescence of microstructured quantum well systems.
36#
發(fā)表于 2025-3-27 19:49:15 | 只看該作者
37#
發(fā)表于 2025-3-27 22:04:07 | 只看該作者
38#
發(fā)表于 2025-3-28 03:04:28 | 只看該作者
High Magnetic Fields and Low Dimensional Structures: A Survey of Transport and Optical Effects,a matter of fact, high magnetic fields have become an indispensable tool for the research on 2D systems. This is also reflected by the programs of the recent international conferences which were devoted towards the investigation of the electronic structure of 2D systems.
39#
發(fā)表于 2025-3-28 06:32:30 | 只看該作者
Recent Advances in Microfabrication,meters, and the increased flexibility hereby obtained can be considered as a first step towards real “contact engineering”. Finally, flexibility in the use of substrates has also been increased by the development of novel techniques for composite substrates fabrication and for device transplantation from one substrate to another.
40#
發(fā)表于 2025-3-28 12:37:39 | 只看該作者
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