Titlebook: Designing 2D and 3D Network-on-Chip Architectures; Konstantinos Tatas,Kostas Siozios,Axel Jantsch Book 2014 Springer Science+Business Medi

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On Designing 3-D Platformshe other hand, there are only a few CAD tools for designing 3-D chips (e.g., .Logic [.]). Throughout this chapter we introduce a framework for quantifying the potential gains of employing this new design technology onto digital designs. In contrast to relevant approaches, which are mainly based on m

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Ulrich Pfeiffer M. Sc.,Ralph Weidnern modern technologies and explains the classification to transient, intermittent, and permanent faults. A survey of fault tolerance methods is presented to demonstrate the diversity of available methods. Fault tolerance methods for NoCs are studied at different layers of the OSI reference model.

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parallelism in processor architecture, with interconnect desThis book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology

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https://doi.org/10.1007/978-3-642-29800-4tion of routing algorithm and flow control scheme, the router and link design can begin. In this chapter switching techniques, routing algorithms and flow control schemes are discussed and compared, while the design of a generic 2D and 3D router is illustrated and improvements proposed in the literature are discussed.

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