Titlebook: Design Technology for Heterogeneous Embedded Systems; Gabriela Nicolescu,Ian O‘Connor,Christian Piguet Book 2012 Springer Science+Business

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https://doi.org/10.1007/978-3-662-02684-7a driver in the research for alternative computation concepts beyond the CMOS. The chapter analyzes first the near term alternative, taking as example the SRAM (Static Random Access Memory). In the second part of the chapter, future circuits based on Carbon Nanotubes (CNTs), Nano-Wires (NWs) and Gra

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Gerd Huber,Gisela Gross,Reinhold Schüttlere communication delays between processing cores, and an effective way to diminish this impact on communication is the 3D integration technology and the use of through-silicon vias (TSVs) for inter-layer communication. However, 3D chips present important thermal issues due to the presence of processi

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https://doi.org/10.1007/978-3-662-02617-5promising solution for heterogeneous system manufacturing, as it provides several benefits in terms of performance and cost. This chapter surveys recent literature on 3D stacking technology. After a brief introduction on trends in the electronics field, 3D integration solutions for heterogeneous sys

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