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Titlebook: Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics; Sunil P. Khatri,Robert K. Brayton,Alberto L. Sangi Book 2001 Springer Sc

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發(fā)表于 2025-3-21 17:33:07 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書目名稱Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics
編輯Sunil P. Khatri,Robert K. Brayton,Alberto L. Sangi
視頻videohttp://file.papertrans.cn/241/240376/240376.mp4
圖書封面Titlebook: Cross-Talk Noise Immune VLSI Design Using Regular Layout Fabrics;  Sunil P. Khatri,Robert K. Brayton,Alberto L. Sangi Book 2001 Springer Sc
描述This book was motivated by the problems being faced with shrinking IC process feature sizes. It is well known that as process feature sizes shrink, a host of electrical problems like cross-talk, electromigration, self-heat, etc. are becoming important. Cross-talk is one of the major problems since it results in unpredictable design behavior. In particular, it can result in significant delay variation or signal integrity problems in a wire, depending on the state of its neighboring wires. Typical approaches to tackle the cross-talk problem attempt to fix the problem once it is created. In our approach, we ensure that cross-talk is eliminated by design. The work described in this book attempts to take an "outside-the-box" view and propose a radically different design style. This design style first imposes a fixed layout pattern (or fabric) on the integrated circuit, and then embeds the circuit being implemented into this fabric. The fabric is chosen carefully in order to eliminate the cross-talk problem being faced in modem IC processes. With our choice of fabric, cross-talk between adjacent wires on an IC is reduced by between one and two orders of magnitude. In this way, the fabric
出版日期Book 2001
關(guān)鍵詞Signal; Standard; VLSI; integrated circuit; layout; network; tables
版次1
doihttps://doi.org/10.1007/978-1-4615-1477-0
isbn_softcover978-1-4613-5573-1
isbn_ebook978-1-4615-1477-0
copyrightSpringer Science+Business Media New York 2001
The information of publication is updating

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沙發(fā)
發(fā)表于 2025-3-21 20:32:14 | 只看該作者
https://doi.org/10.1007/978-90-481-8957-1elow 1 .m. Such processes are called Deep Sub-Micron (DSM) processes. With shrinking feature sizes, many new problems arise. Certain electrical problems like cross-talk, electromigration, self-heat and statistical processing variations are becoming increasingly important. Until recently, IC designer
板凳
發(fā)表于 2025-3-22 02:31:20 | 只看該作者
Paul R. Knowles,Philip A. Daviesure sizes of VLSI ICs (which is described in Section 2). We show analytically that the capacitance of a conductor to its neighboring conductors is becoming an increasing fraction of its total capacitance, thus giving rise to a situation where cross-talk problems become increasingly important. In Sec
地板
發(fā)表于 2025-3-22 05:16:09 | 只看該作者
An Intergenerational Study Design,her than this guideline, layout is performed without a strict prior arrangement of wires. This can easily give rise to situations where two or more wires are routed together for long distances on the same metal layer, resulting in crosstalk problems.
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METALS REMOVAL FROM INDUSTRIAL EFFLUENTS, resistant design. The use of minimum-sized transistors in the PLA core results in a fast and dense layout, while a structured arrangement of wires guarantees an effective shielding among signals. The speed and area of each PLA in this design style was reported to be about 50% less than the correspo
7#
發(fā)表于 2025-3-22 21:02:20 | 只看該作者
An Intergenerational Study Design,her than this guideline, layout is performed without a strict prior arrangement of wires. This can easily give rise to situations where two or more wires are routed together for long distances on the same metal layer, resulting in crosstalk problems.
8#
發(fā)表于 2025-3-22 23:22:18 | 只看該作者
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發(fā)表于 2025-3-23 02:28:49 | 只看該作者
METALS REMOVAL FROM INDUSTRIAL EFFLUENTS, resistant design. The use of minimum-sized transistors in the PLA core results in a fast and dense layout, while a structured arrangement of wires guarantees an effective shielding among signals. The speed and area of each PLA in this design style was reported to be about 50% less than the corresponding standard-cell based implementation.
10#
發(fā)表于 2025-3-23 08:26:17 | 只看該作者
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