找回密碼
 To register

QQ登錄

只需一步,快速開始

掃一掃,訪問微社區(qū)

打印 上一主題 下一主題

Titlebook: Compact Models and Performance Investigations for Subthreshold Interconnects; Rohit Dhiman,Rajeevan Chandel Book 2015 Springer India 2015

[復(fù)制鏈接]
樓主: mandatory
21#
發(fā)表于 2025-3-25 03:38:12 | 只看該作者
Soziale Exklusion und Wohlfahrtsstaat,ase in resulting integration density and chip size. The trend toward larger chip size has necessitated using longer interconnects. These connect various components on a very-large-scale integration chip and distribute power, ground, clock, data, and control signals. The performance of a logic gate i
22#
發(fā)表于 2025-3-25 11:29:26 | 只看該作者
23#
發(fā)表于 2025-3-25 12:30:51 | 只看該作者
https://doi.org/10.1007/978-3-531-90499-3OS logic gates. For either an in-phase or out-of-phase transition, the coupling capacitance affects the waveform shape of the output voltage and the propagation delay of each inverter, primarily changing the speed of a CMOS integrated circuit. If one of these CMOS logic gates is quiet, while other l
24#
發(fā)表于 2025-3-25 18:31:36 | 只看該作者
25#
發(fā)表于 2025-3-25 23:52:56 | 只看該作者
26#
發(fā)表于 2025-3-26 01:01:30 | 只看該作者
27#
發(fā)表于 2025-3-26 05:23:22 | 只看該作者
28#
發(fā)表于 2025-3-26 09:01:45 | 只看該作者
Introduction,cation devices, and a host of many other electronic equipments in the present era. VLSI chips find wide applications in all modern electronic circuits and systems. Further, VLSI technology has reduced the voluminous electronic parts which were used to manufacture early day’s electronic equipment and
29#
發(fā)表于 2025-3-26 14:13:45 | 只看該作者
Design Challenges in Subthreshold Interconnect Circuits,exponential growth of the total number of interconnects/wires as the feature size of MOS transistors decreases in scaled deep submicron CMOS technologies. Interconnect length, however, has not scaled down with feature size and remains long relative to other on-chip geometries. Interconnects are meta
30#
發(fā)表于 2025-3-26 18:46:32 | 只看該作者
Subthreshold Interconnect Circuit Design,ase in resulting integration density and chip size. The trend toward larger chip size has necessitated using longer interconnects. These connect various components on a very-large-scale integration chip and distribute power, ground, clock, data, and control signals. The performance of a logic gate i
 關(guān)于派博傳思  派博傳思旗下網(wǎng)站  友情鏈接
派博傳思介紹 公司地理位置 論文服務(wù)流程 影響因子官網(wǎng) 吾愛論文網(wǎng) 大講堂 北京大學(xué) Oxford Uni. Harvard Uni.
發(fā)展歷史沿革 期刊點評 投稿經(jīng)驗總結(jié) SCIENCEGARD IMPACTFACTOR 派博系數(shù) 清華大學(xué) Yale Uni. Stanford Uni.
QQ|Archiver|手機(jī)版|小黑屋| 派博傳思國際 ( 京公網(wǎng)安備110108008328) GMT+8, 2025-10-19 22:55
Copyright © 2001-2015 派博傳思   京公網(wǎng)安備110108008328 版權(quán)所有 All rights reserved
快速回復(fù) 返回頂部 返回列表
信丰县| 昔阳县| 无锡市| 乐安县| 方山县| 茂名市| 禹州市| 罗城| 黄龙县| 蓬莱市| 沙坪坝区| 克山县| 邛崃市| 肇东市| 平乡县| 贵溪市| 泰兴市| 苗栗市| 民乐县| 逊克县| 桂林市| 德昌县| 高邮市| 延川县| 砀山县| 荥经县| 江都市| 万年县| 南江县| 通渭县| 崇文区| 南京市| 宾阳县| 桂东县| 青河县| 诸暨市| 读书| 额济纳旗| 明光市| 隆尧县| 宜丰县|