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Titlebook: Compact Models and Performance Investigations for Subthreshold Interconnects; Rohit Dhiman,Rajeevan Chandel Book 2015 Springer India 2015

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發(fā)表于 2025-3-21 17:47:50 | 只看該作者 |倒序?yàn)g覽 |閱讀模式
書目名稱Compact Models and Performance Investigations for Subthreshold Interconnects
編輯Rohit Dhiman,Rajeevan Chandel
視頻videohttp://file.papertrans.cn/231/230788/230788.mp4
概述Provides compact analytical approach for sub-threshold electrical on-chip interconnects.Includes comprehensive analysis of coupling noise for sub-threshold circuits.Investigates variability issues in
叢書名稱Energy Systems in Electrical Engineering
圖書封面Titlebook: Compact Models and Performance Investigations for Subthreshold Interconnects;  Rohit Dhiman,Rajeevan Chandel Book 2015 Springer India 2015
描述.The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wire length are thoroughly investigated. In addition, the effect of parameters like driver strength on peak coupling noise has also been analyzed. Process, voltage and temperature variations are prominent factors affecting sub-threshold design and have also been investigated. The process variability analysis has been carried out using parametric analysis, process corner analysis and Monte Carlo technique. The book also provides a qualitative summary of the work reported in the literature by various researchers in the design of digital sub-threshold circuits. This book should be of interest for
出版日期Book 2015
關(guān)鍵詞Crosstalk; On-chip Interconnects; Sub-threshold; Variability; Very Large Scale Integration (VLSI)
版次1
doihttps://doi.org/10.1007/978-81-322-2132-6
isbn_softcover978-81-322-2997-1
isbn_ebook978-81-322-2132-6Series ISSN 2199-8582 Series E-ISSN 2199-8590
issn_series 2199-8582
copyrightSpringer India 2015
The information of publication is updating

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2199-8582 r sub-threshold circuits.Investigates variability issues in .The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise
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發(fā)表于 2025-3-22 20:52:22 | 只看該作者
Book 2015ign techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled intercon
8#
發(fā)表于 2025-3-22 21:35:41 | 只看該作者
Soziale Exklusion und Wohlfahrtsstaat,xcess power to be dissipated. Global or long interconnects in nanometer technologies have attracted increasing attention because of their growing influence on the overall performance of integrated circuits over the past few years.
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