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Titlebook: Cleaning Printed Wiring Assemblies in Today’s Environment; Les Hymes Book 1991 Van Nostrand Reinhold 1991 communication.evaluation.informa

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發(fā)表于 2025-3-21 19:32:58 | 只看該作者 |倒序瀏覽 |閱讀模式
書目名稱Cleaning Printed Wiring Assemblies in Today’s Environment
編輯Les Hymes
視頻videohttp://file.papertrans.cn/228/227304/227304.mp4
圖書封面Titlebook: Cleaning Printed Wiring Assemblies in Today’s Environment;  Les Hymes Book 1991 Van Nostrand Reinhold 1991 communication.evaluation.informa
描述The impetus to create this book originated from several concerns. One of these was the perceived value to the industry of a collection in one volume of a wide range of information pertinent to the reasons and techniques for de fluxing printed wiring assemblies (PWAs). This book is expected to be of use not only to those engaged in the electronics packaging industry but also to those in related fields seeking information concerning viable methods of dealing with one of the en- vironmental issues of our time: the destruction of the ozone layer surrounding and protecting the planet with which we have been entrusted. The volume of information relative to providing PW As free of residues ad- versely impacting operation, reliability, and life of electronic products is grow- ing, and it will continue to expand at an accelerated rate as we seek to match our technology needs and desires with our environmental responsibilities. At the time ofthis writing, which has spanned the latter portion of 1989 and early 1990, the issue of choosing a new approach to producing PW As free of detrimental residues while using environmentally acceptable manufacturing techniques ap- peared to be the major con
出版日期Book 1991
關(guān)鍵詞communication; evaluation; information; material; media; technology; telecommunications; testing
版次1
doihttps://doi.org/10.1007/978-94-011-6967-7
isbn_softcover978-94-011-6969-1
isbn_ebook978-94-011-6967-7
copyrightVan Nostrand Reinhold 1991
The information of publication is updating

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沙發(fā)
發(fā)表于 2025-3-21 22:22:08 | 只看該作者
板凳
發(fā)表于 2025-3-22 01:00:34 | 只看該作者
Defluxing for High Reliability Applications and General Environmental Issues,equipment regardless of the customer or end-item use. The materials and processes used are governed by the type of product to be cleaned, the contaminants being removed, and the compatibility of the cleaning system with the product and the environment.
地板
發(fā)表于 2025-3-22 06:12:09 | 只看該作者
Book 1991f a wide range of information pertinent to the reasons and techniques for de fluxing printed wiring assemblies (PWAs). This book is expected to be of use not only to those engaged in the electronics packaging industry but also to those in related fields seeking information concerning viable methods
5#
發(fā)表于 2025-3-22 09:40:51 | 只看該作者
A Reconsideration of the Theory of Inflationess materials and contaminants. This chapter will deal with the relationship of some of these design, material, and process issues and their impact on the cleanability of (and the need to clean) the manufactured PWA.
6#
發(fā)表于 2025-3-22 13:42:20 | 只看該作者
Francisco Rodrigo Porto Cavalcantire is weighty evidence that the way we live now may ultimately result in our demise as a species. As there are few volunteers for a change in modern lifestyle it therefore behooves us to change the ways to maintain that lifestyle. Aqueous processing is one of the attractive (and relatively painless) alternatives..
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發(fā)表于 2025-3-22 18:29:53 | 只看該作者
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發(fā)表于 2025-3-22 22:17:42 | 只看該作者
9#
發(fā)表于 2025-3-23 01:31:54 | 只看該作者
A Reconsideration of the Theory of Inflationion is also known as defluxing. However, cleaning in relation to printed wiring board assemblies and surface mount assemblies has a broader meaning. A cleaning operation can potentially follow any process operation. If one is referring specifically to that cleaning operation following the soldering process, the term . will be used.
10#
發(fā)表于 2025-3-23 07:58:45 | 只看該作者
Solvent Defluxing of Printed Wiring Board Assemblies and Surface Mount Assemblies: Materials, Proceion is also known as defluxing. However, cleaning in relation to printed wiring board assemblies and surface mount assemblies has a broader meaning. A cleaning operation can potentially follow any process operation. If one is referring specifically to that cleaning operation following the soldering process, the term . will be used.
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